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Buy Clear Epoxy Solvent Free, Low Viscosity, Good Wetting, For Fiber Optic, Electronic, Aerospace, Laminating & Bonding 2113, 5gm in United States - Cartnear.com

Clear Epoxy Solvent Free, Low Viscosity, Good Wetting, For Fiber Optic, Electronic, Aerospace, Laminating & Bonding 2113, 5gm

CTNR1482595 CTNR1482595

Atom Adhesives

Atom Adhesives
2025-12-22 USD 13.67

$ 13.67 $ 13.95 2% Off

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Clear Epoxy Solvent Free, Low Viscosity, Good Wetting, For Fiber Optic, Electronic, Aerospace, Laminating & Bonding 2113, 5gm
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Clear Epoxy Solvent Free, Low Viscosity, Good Wetting, For Fiber Optic, Electronic, Aerospace, Laminating & Bonding 2113, 5gm
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Brand Atom Adhesives
Model AA-BOND 2113-5
Type Adhesives
Color/Finish Clear
Application Assembly and repair work of fiber optic and other high performance electronic and aerospace systems and components, and for structural laminating applications where an initial low viscosity and near transparent "color" are needed.
Features Good wetting, Solvent free, excellent flow ability, Adheres strongly to numerous substrates
- PRODUCT DESCRIPTION: AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to glass, ceramics, most metals and many plastics. AA-BOND 2113 is particularly recommended for assembly and repair work of fiber optic and other high performance electronic and aerospace systems and components, and for structural laminating applications where an initial low viscosity and near transparent "color" are needed. AA-BOND 2113 is a good electrical insulator, provides excellent resistance to weather, galvanic action, salt solutions and many other chemicals including mild acid and alkalis, petroleum solvents, lubricating oils, jet fuels and gasoline, and alcohol. - GENERAL PROPERTIES: • Appearance Clear transparent • Cure Type Room temperature or Heat Cure • Benefits: o Good wetting o Solvent free o Excellent flowability o Adheres strongly to numerous substrates • Mix Ratio by weight: 100:11 / Resin:Hardener • Substrates: Ceramics, glass to glass, fabrics, metals, laminates and other composite materials • Operating Temperature: -60 to 130 °C - UNCURED PROPERTIES: • Specific Gravity: 1.15 • Reactive solids contents, %: 100 • Pot Life: 30 minutes - CURE SCHEDULE: • 4 hours @ 65°C • 24 hours @ 25°C - MISC PROPERTIES: • Volume Resistivity: 6.00e+13 ohm-cm • Dielectric Constant: 4.2 • Dielectric Strength: 410 volts/mil • Hardness, Shore D: 88 • Dissipation factor: 0.020 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more information.

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