High Impact Absorption Silver Epoxy, High Strength Adhesive, Electrically Conductive, Heat & Stress Resistance Applications, Cure Only, 1 Part 2979, 5gm Syringe
- PRODUCT DESCRIPTION:
AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability.
AA-DUCT 2979 has been shown to retain their properties through hundreds of hours of rapid temperature cycling and has also high impact absorption and stress resistance.
- PRODUCT PROPERTIES:
Appearance Silver
Cure Type Heat cure
Benefits:
+ High strength
+ Excellent mechanical, electrical properties
Substrates Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature -40°C to 175 °C
NASA Outgassing Passes
Thixotropic Index 3.4
Pot Life 6
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps 65,000 @ Temperature 77.0 °F
Shelf Life 6 months
Adhesive Bond Strength 1750 psi
Density 3.5
Thermal Conductivity, W/m.K 0.90
Coefficient of Thermal Expansion 57x 10^-6 (in/in) °C
Lap Shear Strength, PSI 9200
- CURE SCHEDULE:
10 minutes @ 150°C
1 hour @ 125°C
- CURED PROPERTIES:
Hardness, Shore D 86
Volume Resistivity ohm-cm 3 x 10-4
- ELECTRICAL PROPERTIES:
Glass Transition Temp, Tg 45.0 °C, 113 °F
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Flexible Silver Epoxy, Cold Solder, Electrically Conductive Adhesive, Circuits, Electrical Modules, Wave Guides, Flat Cable & High Frequency Shields Repair Kit 916, 500gm
- PRODUCT DESCRIPTION:
AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.
AA-DUCT 916 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.
AA-DUCT 916 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, wave guides, flat cable and high frequency shields.
- PRODUCT DESCRIPTION
Appearance Silver
Cure Type Heat cure or Room temperature
Benefits High strength
Perfect bond
Cold solder for heat sensitive components
Mix Ratio by weight 100:115 / Resin:Hardener
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps Paste
Specific Gravity, mixed 2.85
Reactive solids contents, % 100
Pot Life 3 hours
Shelf life 1 year
- CURED PROPERTIES:
Hardness, Shore D 64
Volume Resistivity ohm. cm
Electronic Industries Epoxy Special Formulation Adhesive For PCB Components & Assembly, Aerospace, 2 Part, Thixotropic 2104, 10gm
- PRODUCT DESCRIPTION:
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties.
AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Milky translucent
Cure Type: Room temperature or Heat cure
Benefits:
* Great for Aerospace applications
* Great for reinforcing applications
* Bonds to many substrates
Mix Ratio by weight : 100:22 / Resin:Hardener
Substrates Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature: -40 to 125 °C
Typical Application(s):
PCB components, aerospace, anything where superior properties are required
- UNCURED PROPERTIES:
Solids Content: 100%
Specific Gravity, mixed: 1.19 g/cc
Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
MISC PROPERTIES:
Hardness, Shore D 88
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
High Temperature Adhesives, Fast Cure Epoxy, Low Viscosity, Fiber Optic, Connectors, Small Potting & Sealing Applications 2 Part F123BK, 250gm
- PRODUCT DESCRIPTION:
AA-BOND F123BK is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connectors. It exhibits good wicking, and develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that includes most metals, ceramics, glass and many plastics.
AA-BOND F123BK has good impact and thermal shock resistance, and yields excellent low stress, pot-and-polish connections which do not piston during cycle tests. It is also resistant to water and weathering, vapors and gases, most petroleum products, and an extended range of organic and inorganic environments. Shorter cures at higher temperatures (e.g. 2 minutes at 120°C or 1 minute at 150°C) are also possible. An additional post-cure of 30 minutes at 150°C is recommended when application temperatures higher than 150°C are anticipated.
- GENERAL PROPERTIES:
• Color: Black
• Components: 2 component - requires mixing
• Mix Ratio by weight: 100:10 / Resin:Hardener
• Benefits:
o Low viscosity
o Thermal shock and impact resistant
o Low stress connections
• Cure Type: Room temperature or Heat Cure
• Operating Temperature: -60 to 175 °C
• Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications.
- UNCURED PROPERTIES:
• Viscosity @ 25 °C : 2100
• Specific Gravity: 1.19
• Pot Life: 2 hours
- CURE SCHEDULE:
• 24 hours @ 25°C
• 5 minutes @ 100°C
- CURED PROPERTIES:
• Glass Transition (Tg), ultimate, °C: 120
• Hardness, Shore D: 85
• Refractive Index: 1.54
• Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Clear Epoxy, High Impact, Low Viscosity Adhesive for Fiber Optic Assembly, Small Potting & Sealing Applications, Multimode & Single Mode Connectors, 2 Part, AA-BOND F113 , 100gm Jar
- PRODUCT DESCRIPTION:
AA-BOND F113 is an Optically Clear, low viscosity , High impact epoxy adhesives developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, and other optical components.
AA-BOND F113 is recommended for laminating, bonding, and sealing applications where excellent wetting, good pot life and improved impact strength properties are required.
AA-BOND F113 is two parts adhesive easily mixed and cured at room temperature and develops strong bond to glass and glass fibers, ceramics, many metals and most rigid plastics.
AA-BOND F113 bonds offer resistance to mechanical impact and thermal shock, and is also resistant to weather, water, gases and vapors, petroleum products, and mild acids and alkalis.
- GENERAL PROPERTIES:
Appearance: Clear
Components: 2 component - requires mixing
Mix Ratio by weight: 100:30 / Resin:Hardener
Benefits: Low viscosity
Thermal shock and impact resistant
Low stress connections
Cure Type: Room temperature or Heat Cure
Operating Temperature: -60 to 120 °C
Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications
- UNCURED PROPERTIES:
Viscosity @ 25 °C: 175
Thixotropic Index: 1.0
Specific Gravity: 1.23
Pot Life: 1.5 hours
- CURE SCHEDULE:
24 hours @ 25°C
1-2 hours @ 65°C
- CURED PROPERTIES:
Coefficient of Thermal Expansion, cm/cm/ºC: 6.20×10+01
Glass Transition Temperature (Tg), ultimate, °C: 102
Hardness, Shore D: 86
Refractive Index: 1.51
Water Absorption , after 24 hours saturation, %: 0.07
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Electrically Conductive Epoxy, Carbon Filled Adhesive, Room Temperature Cure, AA-CARB 61, 5gm kit
*******************Note: This product is not to be used for windshield repair*******************
- PRODUCT DESCRIPTION:
AA-CARB 61 is an epoxy adhesive and coating formulation based on conductive carbon.AA-CARB 61 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
AA-CARB 61 cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar and dissimilar substrates.
- GENERAL PROPERTIES:
Appearance: Black
Cure Type: Heat Cure or Room temperature
Benefits:
• Continuity of conductivity
• High adhesion
• Wide operating temperature range
• Mix Ratio by weight 100:10 / Resin:Hardener
• Substrates:
• Aluminum
• Copper
• Magnesium
• Steel,
• Bronze
• Nickel
• Ceramic
• Glass
• Phenolic,
• G-10 epoxy glass boards
Operating Temperature: -50 to 145 °C
- TYPICAL APPLICATIONS:
Electronic bonding and sealing applications that require both fine electrical and mechanical properties.
- UNCURED PROPERTIES:
Compressive Strength, psi: 13,000
Specific Gravity, mixed: 1.35 g/cc
Pot Life: 30 minutes
- CURE SCHEDULE:
15 minutes At 100°C
1 hour At 60°C
24 hours At 25°C
- MISC PROPERTIES:
Volume Resistivity ohm • cm < 40
Tensile Strength, psi 8,500
Shrinkage Linear 0.003 in/in
Hardness, Shore D 85
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
*******************Note: This product is not to be used for windshield repair*******************
High Temperature Adhesive, Fast Cure Epoxy, Low Shrinkage & Viscosity, 2 Part Fiber Optic Connectors Assembly, Multimode & Single Mode Connectors F125, 250gm
- PRODUCT DESCRIPTION:
AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications.
AA-BOND F125 is clear, two part system is easily mixed and used at room temperature. Fiber optic connectors can be polished in as little as 15 to 20 minutes for piston free assurance. The high bond strength of AA-BOND F125 to glass, plastics, ceramics, metals and masonry allows it to be used in a wide array of applications including lens bonding, connector backfills, construction, component assembly and maintenance repair.
AA-BOND F125 is low shrinkage epoxy, develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25°C is required for fully matured bonds.
NOTE: AA-BOND F125 develops a high exotherm. Use immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready before mixing.
- GENERAL PROPERTIES:
• Components: 2 component - requires mixing
• Mix Ratio by weight: 100:95 / Resin:Hardener
• Benefits:
o Low viscosity
o Fast Cure
o Low shrinkage
• Cure Type: Room temperature or Heat cure
• Operating Temperature :-60 to 100 °C
• Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications
- UNCURED PROPERTIES:
• Viscosity @ 25 °C:
o Resin: 9000cP
o Hardener: 14000cP
• Specific Gravity :1.19
• Pot Life: 5 minutes
- CURE SCHEDULE:
• 24 hours @ 25°C
• 1 hour @ 60°C
- CURED PROPERTIES:
• Glass Transition (Tg), ultimate, °C: 40
• Hardness, Shore D: 75
• Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
General Prupose Epoxy Casting, Versatile Formula Adhesive, AA-CAST 156, 100gm kit
PRODUCT DESCRIPTION:
This is an easy-to-use, low cost, versatile epoxy resin and hardener system developed for general purpose casting applications. It develops excellent adhesion to most metals, plastics, and ceramics, and is recommended for electrical and structural potting and encapsulating applications where the combination of good mechanical, thermal, electrical and RT Cure properties are required. Fully cured this product is a strong, tough, electrical insulator with high heat stability and a low thermal coefficient of expansion that provides successful performance over a wide temperature range. It is resistant to industrial environments that include water, weather, galvanic action, petroleum fuels, lubricants and solvents, gases and vapors, many mild acids and alkalis.
Call (888) 522-6742 For More Informations.
Flexible Silver Epoxy, Cold Solder, Electrically Conductive Adhesive, Circuits, Electrical Modules, Wave Guides, Flat Cable & High Frequency Shields Repair Kit 916, 250gm
- PRODUCT DESCRIPTION:
AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.
AA-DUCT 916 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.
AA-DUCT 916 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, wave guides, flat cable and high frequency shields.
- PRODUCT DESCRIPTION:
Appearance :Silver
Cure Type: Heat cure or Room temperature
Benefits:
High strength
Perfect bond
Cold solder for heat sensitive components
Mix Ratio by weight 100:115 / Resin:Hardener
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps Paste
Specific Gravity, mixed 2.85
Reactive solids contents, % 100
Pot Life 3 hours
Shelf life 1 year
- CURED PROPERTIES:
Hardness, Shore D 64
Volume Resistivity ohm. cm
Flexible Epoxy Adhesive For Automotive, Medical, Aerospace, Photonic, Assembly Industries, Plastic Bonder, Plastic Repair 2170, 100gm kit
- PRODUCT DESCRIPTION:
AA-BOND 2170 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, kapton or almost any thermoplastic substrate. AA-BOND 2170 is low viscosity and easy to apply, can cure at room temperature.
AA-BOND 2170 is high technology epoxy was formulated for applications in the automotive, medial, aerospace, photonic and assembly industries and can be used anywhere that require excellent chemical fastening to plastic parts.
- GENERAL PROPERTIES:
Appearance: Amber
Cure Type: Room temperature or Heat cure
Benefits:
Low viscosity
Easy to apply
Mix Ratio by weight 100:100 / Resin:Hardener
Operating Temperature: -60 to 115 °C
Typical Applications:
Automotive, Medical, Aerospace, Photonic, Assembly, industries, Also can be used anywhere that requires excellent chemical fastening to plastic parts.
- UNCURED PROPERTIES:
Viscosity @ 25 °C: 3,400
Specific Gravity, mixed: 1.19
Reactive solids contents, %: 100
Pot Life :60 minutes
- CURE SCHEDULE:
1 hour @ 65°C
24 hours @ 25°C
- CURED PROPERTIES:
Glass transition temperature (Tg), °C: 10
Hardness, Shore D: 65
Lap shear strength, psi: 2400 (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Heat Resistant Epoxy Adhesive, 1:1 Mixing, Weather Resistant, Staking Components, Bonding, Laminating & Repair Applications Glue 28, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND 28 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength.
AA-BOND 28 contains a thixotrophic agent which impedes thinning out of the material during heat cure when properly mixed and cured.
- GENERAL PROPERTIES
• Appearance Amber
• Cure Type Room temperature or Heat Cure
• Operating Temperature: -60 to 163 °C
• Mix Ratio by weight 100:100 / Resin:Hardener
• Typical Application(s):
Staking components, bonding, laminating and repair applications
• Benefits:
o Room temperature or Heat Cure
o Tough enamel like cure
o Bonds to a variety of substrates
o Weather resistant
• Substrates:
o Metals
o Glass
o Ceramics
o Wood and many plastics
- UNCURED PROPERTIES:
Specific Gravity, mixed 1.07
Reactive solids contents, % 100
Pot Life 60 minutes
- CURE SCHEDULE:
• 4 to 6 hours @ 65°C
• 24 hours @ 25°C
- MISC PROPERTIES:
• Shelf Life 2 years closed packaging
• Glass Transition Temp, Tg 93°C
• Hardness, Shore D 78
• Lap shear 2900 psi (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA's Outgassing For EMI RFI Shielding, Circuit Boards & Electronic Component N02, 2.5gm
- PRODUCT DESCRIPTION: AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly. AA-DUCT N02 passes NASA's outgassing testing (ASTM E-595) and is listed in NASA's Outgassing Data for Selecting Spacecraft Materials list. AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C. AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing. - PRODUCT DESCRIPTION: Base: Epoxy Appearance Grey Cure Type Heat cure or Room temperature Mix Ratio by weight 100:6 / Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature -60 to 110 °C Viscosity @ 25 °C cps Soft Paste Shelf Life 6 months - CURED PROPERTIES: Hardness, Shore D 88 Volume Resistivity ohm-cm 3.8 x 10-2 - CURE SCHEDULE: 2 Hours @ 125 °C 1 hour @ 150°C 30 min @ 175 °C - THERMAL CHARACTERISTICS: Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1 Operating Temp. Range, °C -55 to +175 - NASA OUTGASSING RESULTS: TML (Total Mass Loss) % 0.25 CVCM (Collected Volatile Condensable Materials) % 0.00 WVR (Water Vapor Recovery) % 0.07 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages.
Metal Repair Epoxy Adhesive, Steel filled, High Performance, AA-BOND FS313, 250 gm pouch
PRODUCT DESCRIPTION:
This Product is steel epoxy, tooling resin features a highly filled, low viscosity composition for low shrinkage,can be easily drilled, tapped, polished, milled, sawed, or turned on a lathe, with conventional metal-working tools. This unique resin system is recommended for the fabrication of metal and vacuum form molds, hammer forms, drop hammer dies, foundry patterns, master molds, core filling, draw and stretch dies, lay-up molds, etc. Easy mix pre-measured pouch. Simple mix and use without any mess.
High Impact Absorption Silver Epoxy, High Strength Adhesive, Electrically Conductive, Heat & Stress Resistance Applications, Cure Only, 1 Part 2979, 2.5gm
- PRODUCT DESCRIPTION: AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability. AA-DUCT 2979 has been shown to retain their properties through hundreds of hours of rapid temperature cycling and has also high impact absorption and stress resistance. - PRODUCT PROPERTIES: Appearance Silver Cure Type Heat cure Benefits: + High strength + Excellent mechanical, electrical properties Substrates Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature -40°C to 175 °C NASA Outgassing Passes Thixotropic Index 3.4 Pot Life 6 - UNCURED PROPERTIES: Viscosity @ 25 °C cps 65, 000 @ Temperature 77.0 °F Shelf Life 6 months Adhesive Bond Strength 1750 psi Density 3.5 Thermal Conductivity, W/m. K 0.90 Coefficient of Thermal Expansion 57x 10^-6 (in/in) °C Lap Shear Strength, PSI 9200 - CURE SCHEDULE: 10 minutes @ 150°C 1 hour @ 125°C - CURED PROPERTIES: Hardness, Shore D 86 Volume Resistivity ohm-cm 3 x 10-4 - ELECTRICAL PROPERTIES: Glass Transition Temp, Tg 45.0 °C, 113 °F - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 for more information.
FDA Epoxy Adhesive, Medical Grade Medium Viscosity, AA-BOND FDA26, 100gm
- PRODUCT DESCRIPTION: AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food preparation, processing and packaging equipment and devices. - PRODUCT PROPERTIES: Appearance: Grey Cure Type: Heat cure or Room temperature Benefits: * Excellent durability * High shear and peel strength * Heat and impact resistant * Handy duo-pack cartridges for easy mixing Mix Ratio by weight: 100:14 / Resin: Hardener Substrates: Most metals, ceramic, glass and plastics Operating Temperatures: -60 to 135 °C - UNCURED PROPERTIES: Viscosity @ 25 °C, cps: 17, 500 ±1000 @ temperature 77 °F, 25 °C Specific Gravity, mixed: 2.36 Reactive solids contents, %: 100 Pot Life: 50 minutes - CURE SCHEDULE: 1-4 Hours: @ 65°C 24 Hours: @ 25°C - CURED PROPERTIES: * Adhesive Bond Strength, psi: o 2120 ( 1 hr @ 65°C) o 2190 (24 hrs @ 25°C) * Hardness, Shore D 86 (24 HR @ 25°C) * 90 (1 hr @ 65°C) - THERMAL PROPERTIES: Glass transition temperature (Tg) 113°C, 235 °F - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 For More Informations.
FDA Medical Grade Adhesive, Low Permeability & Viscosity Epoxy, Good Resistance, Electrical Insulator for Bonding & Coating Applications 2 Part, FDA15, 100 gm kit
- PRODUCT DESCRIPTION:
AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration Chapter 1, Sub Part B, Sections 175.105 and 175.300.
AA-BOND FDA15 is two-part adhesive is used for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
AA-BOND FDA15 is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and inorganic compounds.
- GENERAL PROPERTIES:
• Appearance Clear
• Cure Type Heat cure or Room temperature
• Benefits:
* Low viscosity
* Good resistance
* Effective electrical insulator
* Low permeability
Mix Ratio by weight 100:20 / Resin:Hardener
• Substrates:
* Most metals
* Ceramic
* Glass and plastics
* Operating Temperature -60 to 140 °C.
- Typical Application:
Developed for bonding and coating applications.
- UNCURED PROPERTIES:
Viscosity At 25 °C 4,300 Thixotropic Index 1.0 Specific Gravity, mixed 1.16 g/cc Reactive solids contents, % 100Pot Life 25 minutes.
- CURE SCHEDULE:
• 1-4 hours At 65°C
• 24 hours At 25°C.
- CURED PROPERTIES:
Glass transition temperature (Tg), °C 100 Hardness, Shore D 87Water Absorption, % 0.23Dielectric strength, Volts/mil 420Lap shear strength, psi 2000 (Alum to Alum).
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
Call (888) 522-6742 For More Informations.
Electronic Industries Epoxy Special Formulation Adhesive For PCB Components & Assembly, Aerospace, 2 Part, Thixotropic 2104, 250gm
PRODUCT DESCRIPTION:
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties.
AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
GENERAL PROPERTIES
Appearance Milky translucent
Cure Type Room temperature or Heat cure
Benefits Great for Aerospace applications
Great for reinforcing applications
Bonds to many substrates
Mix Ratio by weight 100:22 / Resin:Hardener
Substrates Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature -40 to 125 °C
Typical Application(s) PCB components, aerospace, anything where superior properties are required
UNCURED PROPERTIES:
Solids Content 100%
Specific Gravity, mixed 1.19 g/cc
Pot Life 30 minutes
CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
MISC PROPERTIES:
Hardness, Shore D 88
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages
CALL (888) 522-6742 for more information.
Transparent Adhesive, Rigid Epoxy, Clear, Low Viscosity, Chemicals Resistant ,Room Temperature Cure, Perfect Insulative Properties Glue Repair Kit F110, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. AA-BOND F110 is room temperature system an excellent choice for thin bond-line assembly and repair applications of prisms, lenses and other optic components. And its high strength makes this epoxy ideal for structural applications.
AA-BOND F110 exhibits excellent wetting and wicking capabilities which allows it to adhere strongly to glass, ceramics, metals and most rigid plastics.
- GENERAL PROPERTIES:
• Appearance: Transparent, clear
• Cure Type: Room temperature or Heat cure
• Benefits:
o High strength
o Perfect insulative properties
o Good resistance to salt solutions, mild acids and Alkalis and many other chemicals
• Mix Ratio by weight 100:11 / Resin:Hardener
• Operating Temperature: -60 to 130 °C
• Typical Applications:
Exhibits excellent wetting and wicking capabilities, which allows it to adhere strongly to glass, ceramics, metals, and most rigid plastics.
• Volume Resistivity: 6.00e+13 ohm-cm
- UNCURED PROPERTIES:
• Viscosity @ 25 °C: 310
• Thixotropic Index: 1.0
• Specific Gravity, mixed: 1.16
• Reactive solids contents, %: 100
• Pot Life: 30 minutes
- CURE SCHEDULE:
• 5 minutes @ 100°C
• 2 minutes @ 120°C
• 1 minute @ 150°C
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C: 90
• Hardness, Shore D: 83
• Refractive Index: 1.54
• Lap shear strength, psi:
o 2150 (alum to alum, 24 hrs @ 25°C)
o 2600 (alum to alum, 1 hr @ 65°C)
o 3000( alum to alum, 4 hrs @ 65°C)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Milky Epoxy Solvent Free Passes NASA, Weather Resistant Adhesive For Critical Electronics, Aerospace, Industrial Applications Non-Sag Adhesive 2116, 250gm
- PRODUCT DESCRIPTION:
AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.
AA-BOND 2116 is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.
AA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.
- GENERAL PROPERTIES:
• Appearance Milky translucent
• Cure Type Room temperature or Heat Cure
• Benefits:
o Passes NASA's Outgassing/Low Outgassing
o Solvent free
o Weather resistant
• Mix Ratio by weight: 100:22.5 / Resin:Hardener
• Substrates:
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
• Operating Temperature: -60 to 130 °C
- UNCURED PROPERTIES:
• Specific Gravity : 1.25
• Reactive solids contents, %: 100
• Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
- MISC PROPERTIES:
Volume Resistivity: 6.00e+13 ohm-cm
Dielectric Constant: 4.5
Dielectric Strength: 410 kV/mil
Hardness, Shore D: 88
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
Flexible Silver Epoxy, Cold Solder, Electrically Conductive Adhesive, Circuits, Electrical Modules, Wave Guides, Flat Cable & High Frequency Shields Repair Kit 916, 50gm
- PRODUCT DESCRIPTION: AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties. AA-DUCT 916 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates. AA-DUCT 916 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, wave guides, flat cable and high frequency shields. - PRODUCT DESCRIPTION: Appearance: Silver Cure Type: Heat cure or Room temperature Benefits: High strength Perfect bond Cold solder for heat sensitive components Mix Ratio by weight 100:115 / Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. - UNCURED PROPERTIES: Viscosity @ 25 °C cps Paste Specific Gravity, mixed 2.85 Reactive solids contents, % 100 Pot Life 3 hours Shelf life 1 year - CURED PROPERTIES: Hardness, Shore D 64 Volume Resistivity ohm. cm < 0.0001 - CURE SCHEDULE: 1 to 4 Hours @ 65 °C 24 hours @ 25 °C - ELECTRICAL PROPERTIES: 0.00060 ohm-cm cured 5 min @ 160°C 0.00080 ohm-cm cured 24 hrs @ 25 °C cured 2 hrs @ 65 °C 0.0012 ohm-cm cured 1 hr @ 110 °C - THERMAL PROPERTIES: Thermal Conductivity 10.4 BTU-in/hr-ft²-°F Glass Transition Temp, Tg 11.1 BTU-in/hr-ft²-°F Operating Temperature 5.00 °C 41.0 °F Operating Temperature -60 to 110 °C - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 for more information.
Electronic Industries Epoxy, Special Formulation Adhesive For PCB Components & Assembly, Aerospace, 2 Part, Thixotropic 2104, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties.
AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Milky translucent
Cure Type: Room temperature or Heat cure
Benefits:
* Great for Aerospace applications
* Great for reinforcing applications
* Bonds to many substrates
Mix Ratio by weight : 100:22 / Resin:Hardener
Substrates Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature: -40 to 125 °C
Typical Application(s):
PCB components, aerospace, anything where superior properties are required
- UNCURED PROPERTIES:
Solids Content: 100%
Specific Gravity, mixed: 1.19 g/cc
Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
MISC PROPERTIES:
Hardness, Shore D 88
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
Clear Epoxy, High Impact, Low Viscosity Adhesive for Fiber Optic Assembly, Small Potting & Sealing Applications, Multimode & Single Mode Connectors, 2 Part, AA-BOND F113, 250gm Jar
- PRODUCT DESCRIPTION:
AA-BOND F113 is an Optically Clear, low viscosity , High impact epoxy adhesives developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, and other optical components.
AA-BOND F113 is recommended for laminating, bonding, and sealing applications where excellent wetting, good pot life and improved impact strength properties are required.
AA-BOND F113 is two parts adhesive easily mixed and cured at room temperature and develops strong bond to glass and glass fibers, ceramics, many metals and most rigid plastics.
AA-BOND F113 bonds offer resistance to mechanical impact and thermal shock, and is also resistant to weather, water, gases and vapors, petroleum products, and mild acids and alkalis.
- GENERAL PROPERTIES:
Appearance: Clear
Components: 2 component - requires mixing
Mix Ratio by weight: 100:30 / Resin:Hardener
Benefits: Low viscosity
Thermal shock and impact resistant
Low stress connections
Cure Type: Room temperature or Heat Cure
Operating Temperature: -60 to 120 °C
Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications
- UNCURED PROPERTIES:
Viscosity @ 25 °C: 175
Thixotropic Index: 1.0
Specific Gravity: 1.23
Pot Life: 1.5 hours
- CURE SCHEDULE:
24 hours @ 25°C
1-2 hours @ 65°C
- CURED PROPERTIES:
Coefficient of Thermal Expansion, cm/cm/ºC: 6.20×10+01
Glass Transition Temperature (Tg), ultimate, °C: 102
Hardness, Shore D: 86
Refractive Index: 1.51
Water Absorption , after 24 hours saturation, %: 0.07
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Metal Repair Epoxy, Steel filled Adhesive, High Performance, AA-BOND FS313 , 100gm kit
PRODUCT DESCRIPTION:
This Product is steel epoxy, tooling resin features a highly filled, low viscosity composition for low shrinkage,can be easily drilled, tapped, polished, milled, sawed, or turned on a lathe, with conventional metal-working tools. This unique resin system is recommended for the fabrication of metal and vacuum form molds, hammer forms, drop hammer dies, foundry patterns, master molds, core filling, draw and stretch dies, lay-up molds, etc. Easy mix pre-measured pouch. Simple mix and use without any mess.
High Strength Epoxy Adhesive, Perfect Bond Glue For Printed Circuit Boards, Wave Guides, Electronic Modules, Flat Cable, Static, EMI & RFI Shielding, Connections & Circuitry CG2, 50 gm Jar
- PRODUCT DESCRIPTION:
AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive.
AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry.
- GENERAL INFORMATION:
Appearance: Silver
Coated ceramic %Silver coated ceramic : 76
Cure Type: Heat cure
Benefits:
- High strength
- Perfect bond
- EMI & RFI shielding
- Wave guides
Substrates: Excellent choice for the Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Catalyst: Anhydride
- CURED PROPERTIES:
Sheet Resistivity:
Color coded Epoxy, High Temperature Adhesive, Fast Cure, Two Part, Fiber Optic Connectors Repair & Assembly, F123, 100gm
- PRODUCT DESCRIPTION:
AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connectors. Although this unique three-step color-change formulation unmixed components are light yellow, it turns light green on mixing, and changes again to a deep reddish-amber after the REQUIRED 100°C HIGH TEMPERATURE CURE. It exhibits good wicking, and develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that includes most metals, ceramics, glass and many plastics.
AA-BOND F123 has good impact and thermal shock resistance, and yields excellent low stress, pot-and-polish connections which do not piston during cycle tests. It is also resistant to water and weathering, vapors and gases, most petroleum products, and an extended range of organic and inorganic environments. Shorter cures at higher temperatures e.g. 2 minutes at 120°C or 1 minute at 150°C are also possible. An additional post-cure of 30 minutes at 150°C is recommended when application temperatures higher than 150°C are anticipated.
- GENERAL PROPERTIES:
+Color: Clear, Light Yellow Unmixed
Clear, Reddish-Brown Cured
+ Components 2 component - requires mixing
+ Mix Ratio by weight 100:10 / Resin:Hardener
+ Benefits
Low viscosity, Thermal shock and impact resistant, Low stress connections, Color coded
- Cure Type: Room temperature or Heat Cure
- Operating Temperature: -60 to 175 °C
- Typical Applications:
Fiber optic assembly, multimode. single mode connectors, small potting, and sealing applications.
- UNCURED PROPERTIES:
Viscosity At 25 °C : 2100
Specific Gravity: 1.19
Pot Life: 2 hours
- CURE SCHEDULE:
24 hours At 25°C
5 minutes At 100°C
- CURED PROPERTIES:
Glass Transition (Tg), ultimate, °C: 120
Hardness, Shore D 85
Refractive Index 1.54
Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
CALL (888) 522-6742 for more informations.
Good Electrical Insulation Epoxy, Smooth Paste Adhesive for Fiber Optic Connectors, Photonic & Electronic Applications, LED Displays, Lenses F162, 10gm
- PRODUCT DESCRIPTION:
AA-BOND F162 is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics.
AA-BOND F162 was specifically developed for fiber optic, laser, photonic and electronic applications requiring excellent electrical insulation in combination with effective thermal dissipation from heat-producing components.
AA-BOND F162 is two-part epoxy compound develops strong, durable, stable, high impact thermally conductive bonds at room temperature, and adheres readily to itself, and to metals, many plastics, silica, steatite, alumina, sapphire and other ceramics, glass, and to many other materials.
AA-BOND F162 provides excellent resistance to salt solutions, mild acids and alkalis and many other chemicals including petroleum solvents, lubricating oils and alcohol.
- GENERAL PROPERTIES:
• Appearance: Ligh grey/off white
• Cure Type: Room Temperature or Heat cure
• Benefits:
o Smooth paste
o Fiber optic
o Laser
o Photonic and electronic applications
o Good electrical insulation
• Mix Ratio by weight: 100:10 / Resin:Hardener
• Substrates: Metals, Many plastics, Glass, and other materials
• Operating Temperature: -60 to 120 °C
• Typical Applications: ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components.
• Max Temperature: 125 °C
- UNCURED PROPERTIES:
• Viscosity @ 25 °C: Paste
• Thixotropic Index: 1.0
• Specific Gravity, mixed, g/cc: 2.29
- CURE SCHEDULE:
• 2-4 hours @ 65°C
• 24 hours @ 25°C
- CURED PROPERTIES:
• Thermal Conductivity: 6.09 BTU-in/hr-ft²-°F
• Hardness, Shore D: 88
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA’s Outgassing For EMI RFI Shielding, Circuit Boards & Electronic Component N02, 250gm
- PRODUCT DESCRIPTION:
AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly.
AA-DUCT N02 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list.
AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C.
AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing.
- PRODUCT DESCRIPTION:
Base: Epoxy
Appearance :Grey
Cure Type: Heat cure or Room temperature
Mix Ratio by weight : 100:6 / Resin:Hardener
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature: -60 to 110 °C
Viscosity @ 25 °C cps Soft: Paste
Shelf Life: 6 months
- CURED PROPERTIES:
Hardness, Shore D: 88
Volume Resistivity ohm-cm: 3.8 x 10-2
- CURE SCHEDULE:
2 Hours @ 125 °C
1 hour @ 150°C
30 min @ 175 °C
- THERMAL CHARACTERISTICS:
Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1
Operating Temp. Range, °C: -55 to +175
- NASA OUTGASSING RESULTS:
TML (Total Mass Loss): % 0.25
CVCM (Collected Volatile Condensable Materials): % 0.00
WVR (Water Vapor Recovery): % 0.07
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
- PRODUCT DESCRIPTION:
AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive.
AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry.
- GENERAL INFORMATION:
Appearance: Silver
Coated ceramic %Silver coated ceramic : 76
Cure Type: Heat cure
Benefits:
- High strength
- Perfect bond
- EMI & RFI shielding
- Wave guides
Substrates: Excellent choice for the Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Catalyst: Anhydride
- CURED PROPERTIES:
Sheet Resistivity:
Excellent Durability Adhesive, Heat & Impact Resistant FDA Epoxy, Medical Grade Medium Viscosity, FDA26, 5gm
- PRODUCT DESCRIPTION: AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food preparation, processing and packaging equipment and devices. - PRODUCT PROPERTIES: Appearance: Grey Cure Type: Heat cure or Room temperature Benefits: * Excellent durability * High shear and peel strength * Heat and impact resistant * Handy duo-pack cartridges for easy mixing Mix Ratio by weight: 100:14 / Resin: Hardener Substrates: Most metals, ceramic, glass and plastics Operating Temperatures: -60 to 135 °C - UNCURED PROPERTIES: Viscosity @ 25 °C, cps: 17, 500 ±1000 @ temperature 77 °F, 25 °C Specific Gravity, mixed: 2.36 Reactive solids contents, %: 100 Pot Life: 50 minutes - CURE SCHEDULE: 1-4 Hours: @ 65°C 24 Hours: @ 25°C - CURED PROPERTIES: * Adhesive Bond Strength, psi: o 2120 ( 1 hr @ 65°C) o 2190 (24 hrs @ 25°C) * Hardness, Shore D: o 86 (24 HR @ 25°C) o 90 (1 hr @ 65°C) - THERMAL PROPERTIES: Glass transition temperature (Tg): 113°C, 235 °F - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 For More Informations.
High Temperature Adhesives, Fast Cure Epoxy, Low Viscosity, Fiber Optic, Connectors, Small Potting & Sealing Applications, 2 Part, F123BK 100gm
- PRODUCT DESCRIPTION:
AA-BOND F123BK is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connectors. It exhibits good wicking, and develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that includes most metals, ceramics, glass and many plastics.
AA-BOND F123BK has good impact and thermal shock resistance, and yields excellent low stress, pot-and-polish connections which do not piston during cycle tests. It is also resistant to water and weathering, vapors and gases, most petroleum products, and an extended range of organic and inorganic environments. Shorter cures at higher temperatures (e.g. 2 minutes at 120°C or 1 minute at 150°C) are also possible. An additional post-cure of 30 minutes at 150°C is recommended when application temperatures higher than 150°C are anticipated.
- GENERAL PROPERTIES:
• Color: Black
• Components: 2 component - requires mixing
• Mix Ratio by weight: 100:10 / Resin:Hardener
• Benefits:
o Low viscosity
o Thermal shock and impact resistant
o Low stress connections
• Cure Type: Room temperature or Heat Cure
• Operating Temperature: -60 to 175 °C
• Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications.
- UNCURED PROPERTIES:
• Viscosity @ 25 °C : 2100
• Specific Gravity: 1.19
• Pot Life: 2 hours
- CURE SCHEDULE:
• 24 hours @ 25°C
• 5 minutes @ 100°C
- CURED PROPERTIES:
• Glass Transition (Tg), ultimate, °C: 120
• Hardness, Shore D: 85
• Refractive Index: 1.54
• Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Milky Epoxy Solvent Free Passes NASA, Weather Resistant Adhesive For Critical Electronics, Aerospace, Industrial Applications Non-Sag Adhesive 2116, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.
AA-BOND 2116 is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.
AA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.
- GENERAL PROPERTIES:
• Appearance Milky translucent
• Cure Type Room temperature or Heat Cure
• Benefits:
o Passes NASA's Outgassing/Low Outgassing
o Solvent free
o Weather resistant
• Mix Ratio by weight: 100:22.5 / Resin:Hardener
• Substrates:
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
• Operating Temperature: -60 to 130 °C
- UNCURED PROPERTIES:
• Specific Gravity : 1.25
• Reactive solids contents, %: 100
• Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
- MISC PROPERTIES:
Volume Resistivity: 6.00e+13 ohm-cm
Dielectric Constant: 4.5
Dielectric Strength: 410 kV/mil
Hardness, Shore D: 88
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
High Impact Absorption Silver Epoxy, High Strength Adhesive, Electrically Conductive, Heat & Stress Resistance Applications, Cure Only, 1 Part 2979, 50gm jar
- PRODUCT DESCRIPTION:
AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability.
AA-DUCT 2979 has been shown to retain their properties through hundreds of hours of rapid temperature cycling and has also high impact absorption and stress resistance.
- PRODUCT PROPERTIES:
Appearance Silver
Cure Type Heat cure
Benefits:
+ High strength
+ Excellent mechanical, electrical properties
Substrates Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature -40°C to 175 °C
NASA Outgassing Passes
Thixotropic Index 3.4
Pot Life 6
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps 65,000 @ Temperature 77.0 °F
Shelf Life 6 months
Adhesive Bond Strength 1750 psi
Density 3.5
Thermal Conductivity, W/m.K 0.90
Coefficient of Thermal Expansion 57x 10^-6 (in/in) °C
Lap Shear Strength, PSI 9200
- CURE SCHEDULE:
10 minutes @ 150°C
1 hour @ 125°C
- CURED PROPERTIES:
Hardness, Shore D 86
Volume Resistivity ohm-cm 3 x 10-4
- ELECTRICAL PROPERTIES:
Glass Transition Temp, Tg 45.0 °C, 113 °F
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Metal Repair Epoxy Adhesive, Steel filled, High Performance, AA-BOND FS313, 2.5gm pouch
PRODUCT DESCRIPTION:
This Product is steel epoxy, tooling resin features a highly filled, low viscosity composition for low shrinkage,can be easily drilled, tapped, polished, milled, sawed, or turned on a lathe, with conventional metal-working tools. This unique resin system is recommended for the fabrication of metal and vacuum form molds, hammer forms, drop hammer dies, foundry patterns, master molds, core filling, draw and stretch dies, lay-up molds, etc. Easy mix pre-measured pouch. Simple mix and use without any mess.
High Impact Absorption Silver Epoxy, High Strength Adhesive, Electrically Conductive, Heat & Stress Resistance Applications, Cure Only, 1 Part 2979, 250gm Jar
- PRODUCT DESCRIPTION:
AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability.
AA-DUCT 2979 has been shown to retain their properties through hundreds of hours of rapid temperature cycling and has also high impact absorption and stress resistance.
- PRODUCT PROPERTIES:
Appearance Silver
Cure Type Heat cure
Benefits:
+ High strength
+ Excellent mechanical, electrical properties
Substrates Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature -40°C to 175 °C
NASA Outgassing Passes
Thixotropic Index 3.4
Pot Life 6
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps 65,000 @ Temperature 77.0 °F
Shelf Life 6 months
Adhesive Bond Strength 1750 psi
Density 3.5
Thermal Conductivity, W/m.K 0.90
Coefficient of Thermal Expansion 57x 10^-6 (in/in) °C
Lap Shear Strength, PSI 9200
- CURE SCHEDULE:
10 minutes @ 150°C
1 hour @ 125°C
- CURED PROPERTIES:
Hardness, Shore D 86
Volume Resistivity ohm-cm 3 x 10-4
- ELECTRICAL PROPERTIES:
Glass Transition Temp, Tg 45.0 °C, 113 °F
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
High Temp Epoxy, Fast Cure, Low Visc Adhesive ,2 part, Fiberoptics Adhesive, AA-BOND K5NA, 100gm
This is a three-part, ablative and thermally insulating epoxy compound used in aerospace applications. This smooth, trowellable system is specified by NASA for the Space Shuttle`s solid rocket boosters for close-out and patching of the boosters` thermal protection systems. It is also used for void filling and protecting wires, tubing and other surface protrusions on hypersonic re-entry bodies, nose cones and aircraft engines. This product is impact resistant which makes it an excellent choice for lightweight casting requirements. This product develops strong bonds to most all substrates. It maintains excellent dimensional stability over a wide temperature range and provides protection to weathering, ozone and moisture.
High Temperature Adhesive, Fast Cure Epoxy, Low Shrinkage & Viscosity, 2 Part Fiber Optic Connectors Assembly, Multimode & Single Mode Connectors F125, 100gm
- PRODUCT DESCRIPTION:
AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications.
AA-BOND F125 is clear, two part system is easily mixed and used at room temperature. Fiber optic connectors can be polished in as little as 15 to 20 minutes for piston free assurance. The high bond strength of AA-BOND F125 to glass, plastics, ceramics, metals and masonry allows it to be used in a wide array of applications including lens bonding, connector backfills, construction, component assembly and maintenance repair.
AA-BOND F125 is low shrinkage epoxy, develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25°C is required for fully matured bonds.
NOTE: AA-BOND F125 develops a high exotherm. Use immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready before mixing.
- GENERAL PROPERTIES:
• Components: 2 component - requires mixing
• Mix Ratio by weight: 100:95 / Resin:Hardener
• Benefits:
o Low viscosity
o Fast Cure
o Low shrinkage
• Cure Type: Room temperature or Heat cure
• Operating Temperature :-60 to 100 °C
• Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications
- UNCURED PROPERTIES:
• Viscosity @ 25 °C:
o Resin: 9000cP
o Hardener: 14000cP
• Specific Gravity :1.19
• Pot Life: 5 minutes
- CURE SCHEDULE:
• 24 hours @ 25°C
• 1 hour @ 60°C
- CURED PROPERTIES:
• Glass Transition (Tg), ultimate, °C: 40
• Hardness, Shore D: 75
• Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 100gm
- PRODUCT DESCRIPTION:
AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.
AA-BOND FDA2T is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, lubricants and fuels, to mild acids and alkalis, and many other organic and inorganic compounds.
- PRODUCT PROPERTIES:
Appearance: Amber
Cure Type: Heat cure or Room Temperature
Benefits:
Medium viscosity
Electrically Insulating
Low permeability to gases and vapors
Low temperature cure
Mix Ratio by weight: 100:93 / Resin: Hardener
Typical Applications: Medical, Food preparation processing and packaging
- UNCURED PROPERTIES:
Viscosity @ 25 °C, cps: 25000 ±1000
Specific Gravity, mixed: 1.119
Pot Life: 3 hours
- CURE SCHEDULE:
1 to 4 Hours @ 65°C
24 Hours @ 25°C
- THERMAL PROPERTIES:
CTE, linear: 29.4 µin/in-°F @ temperature 68 °F
Glass Transition Temp, Tg: 70.0 °C, 158 °F
Operating Temperature :-70 to 145 °C
- CURED PROPERTIES:
Coefficient of Thermal Expansion, cm/cm/ºC: 5.30×10-05
Hardness, Shore D: 79
Elongation at Yield: 9.0 %
Adhesive Bond Strength :1800 psi
- ELECTRICAL PROPERTIES:
Volume Resistivity: 1.20e+14 ohm-cm
Dielectric Constant: 3.4 @ frequency 1000 Hz
Dielectric Strength: 420 kV/in
Dissipation Factor: 0.020
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For any Question.
High Strength Perfect Bond Silver Epoxy Adhesive Glue For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 50gm kit
+ PRODUCT DESCRIPTION: AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm*cm. AA-DUCT 902 is also characterized by a wide operating temperature range from –50 to +170°C. AA-DUCT 902 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties. + PRODUCT PROPERTIES: - Appearance: Silver - Cure Type: Heat cure or Room temperature - Benefits: * High strength * Perfect bond * Cold solder for heat-sensitive components - Mix Ratio by weight 100:5 / Resin: Hardener - Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. - Operating Temperature: –50 to +170°C - Typical Applications: Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair + UNCURED PROPERTIES: - Specific Gravity, mixed: 2.79 - Reactive solids contents, %: 100 - Pot Life: 1Hour - Shelf Life: 1 Year - Viscosity: Paste + CURE SCHEDULE: 15 minutes @ 100°C 45 minutes @ 50°C 24 hours @ Room temperature + CURED PROPERTIES: - Hardness, Shore D: 85 - Shrinkage linear in/in: 0.0003 - Lap shear strength, psi: 9400 - Volume Resistivity ohm. cm: < 0.0001 - Thermal Expansion Coefficient, (cm / cm / °C * 10-5): 1.5 - Thermal Conductivity, btu / hr / ft2 / °F / in: 100 - Tensile Strength, psi: 9500 - Compressive Strength, psi: 14, 000 - Heat Distortion, °C: 95 - Electrical Resistivity: < 1x10 -4 ohm*cm + GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). + AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more informations.
General Prupose Epoxy Casting, Versatile Formula Adhesive, AA-CAST 156, 250gm kit
PRODUCT DESCRIPTION:
This is an easy-to-use, low cost, versatile epoxy resin and hardener system developed for general purpose casting applications. It develops excellent adhesion to most metals, plastics, and ceramics, and is recommended for electrical and structural potting and encapsulating applications where the combination of good mechanical, thermal, electrical and RT Cure properties are required. Fully cured this product is a strong, tough, electrical insulator with high heat stability and a low thermal coefficient of expansion that provides successful performance over a wide temperature range. It is resistant to industrial environments that include water, weather, galvanic action, petroleum fuels, lubricants and solvents, gases and vapors, many mild acids and alkalis.
Call (888) 522-6742 For More Informations.
Thermally Conductive Epoxy Adhesive, Electrically Insulating Bond, Fiber Optic Bundles, Potting Glass, Fibers & Fiber Optic Connectors 2 Part 2156, 10gm kit
- PRODUCT DESCRIPTION:
AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
- GENERAL PROPERTIES:
• Appearance: Tan
• Cure Type: Room temperature or Heat cure
• Benefits:
o Fast cure
o Strong
o Durable
o High- impact bonds at room temperature that improves heat
• Mix Ratio by weight 100:23 / Resin:Hardener
• Operating Temperature -70 to 100 °C
• Typical Applications Fiber optic bundles, potting glass fibers and fiber optic connectors
- UNCURED PROPERTIES:
• Viscosity @ 25 °C 12,000 ±1000 (After Mixing)
• Specific Gravity, mixed 2.26
• Reactive solids contents, % 100
• Pot Life 5 minutes
- CURE SCHEDULE:
• 1 hour @ 25°C
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C: 33
• Hardness, Shore D: 79
• Lap shear strength, psi: 3400 (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Thermally Conductive Epoxy Adhesive Electrically Insulating Two Part Thixtropic AA-BOND 2153, 250 grams kit
- PRODUCT DESCRIPTION:
AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards.
AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.
- GENERAL PROPERTIES:
• Appearance Dark grey
• Cure Type Room temperature or Heat Cure
• Benefits:
Strong Durable High impact bonds at room temperature
Mix Ratio by weight 100:7 Resin:Hardener
Operating Temperature -40 to 125 °C
• Typical Applications:
Staking transistors
Diodes
Resistors
Integrated circuits and other heat-sensitive components to printed circuit boards
- UNCURED PROPERTIES:
• Specific Gravity, mixed 2.44
• Reactive solids contents, % 100
• Pot Life 30 minutes
- CURE SCHEDULE:
• 1-3 hours at 65°C
• 24 hours at 25°C.
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C 110
• Hardness, Shore D 88
• Dielectric strength, volts/mil 410
CALL (888) 522-6742 for more informations.
High Strength Perfect Bond Silver Epoxy Adhesive Glue For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 10gm kit
+ PRODUCT DESCRIPTION:
AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm•cm.
AA-DUCT 902 is also characterized by a wide operating temperature range from –50 to +170°C. AA-DUCT 902 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
+ PRODUCT PROPERTIES:
- Appearance: Silver
- Cure Type: Heat cure or Room temperature
- Benefits:
* High strength
* Perfect bond
* Cold solder for heat-sensitive components
- Mix Ratio by weight 100:5 / Resin:Hardener
- Substrates:
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- Operating Temperature: –50 to +170°C
- Typical Applications:
Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
+ UNCURED PROPERTIES:
- Specific Gravity, mixed: 2.79
- Reactive solids contents, %: 100
- Pot Life: 1Hour
- Shelf Life: 1 Year
- Viscosity: Paste
+ CURE SCHEDULE:
15 minutes @ 100°C
45 minutes @ 50°C
24 hours @ Room temperature
+ CURED PROPERTIES:
- Hardness, Shore D: 85
- Shrinkage linear in/in: 0.0003
- Lap shear strength, psi: 9400
- Volume Resistivity ohm. cm :< 0.0001
- Thermal Expansion Coefficient, (cm / cm / °C • 10-5): 1.5
- Thermal Conductivity, btu / hr / ft2 / °F / in: 100
- Tensile Strength, psi: 9500
- Compressive Strength, psi: 14,000
- Heat Distortion, °C: 95
- Electrical Resistivity : < 1x10 -4 ohm•cm
+ GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
+ AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
High Temp Epoxy, Fast Cure Adhesive, Low Visc, 2 part, Fiberoptics Adhesive, AA-BOND K5NA, 400gm
This is a three-part, ablative and thermally insulating epoxy compound used in aerospace applications. This smooth, trowellable system is specified by NASA for the Space Shuttle`s solid rocket boosters for close-out and patching of the boosters` thermal protection systems. It is also used for void filling and protecting wires, tubing and other surface protrusions on hypersonic re-entry bodies, nose cones and aircraft engines. This product is impact resistant which makes it an excellent choice for lightweight casting requirements. This product develops strong bonds to most all substrates. It maintains excellent dimensional stability over a wide temperature range and provides protection to weathering, ozone and moisture.
Thermally Conductive Epoxy Adhesive, Electrically Insulating Bond, Fiber Optic Bundles, Potting Glass, Fibers & Fiber Optic Connectors 2 Part 2156, 100gm Repair Kit
- PRODUCT DESCRIPTION:
AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
- GENERAL PROPERTIES:
• Appearance: Tan
• Cure Type: Room temperature or Heat cure
• Benefits:
o Fast cure
o Strong
o Durable
o High- impact bonds at room temperature that improves heat
• Mix Ratio by weight 100:23 / Resin:Hardener
• Operating Temperature -70 to 100 °C
• Typical Applications Fiber optic bundles, potting glass fibers and fiber optic connectors
- UNCURED PROPERTIES:
• Viscosity @ 25 °C 12,000 ±1000 (After Mixing)
• Specific Gravity, mixed 2.26
• Reactive solids contents, % 100
• Pot Life 5 minutes
- CURE SCHEDULE:
• 1 hour @ 25°C
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C: 33
• Hardness, Shore D: 79
• Lap shear strength, psi: 3400 (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Flexible Epoxy Adhesive For Automotive, Medical, Aerospace, Photonic, Assembly Industries, Plastic Bonder, Plastic Repair 2170, 5gm
- PRODUCT DESCRIPTION:
AA-BOND 2170 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, kapton or almost any thermoplastic substrate. AA-BOND 2170 is low viscosity and easy to apply, can cure at room temperature.
AA-BOND 2170 is high technology epoxy was formulated for applications in the automotive, medial, aerospace, photonic and assembly industries and can be used anywhere that require excellent chemical fastening to plastic parts.
- GENERAL PROPERTIES:
Appearance: Amber
Cure Type: Room temperature or Heat cure
Benefits:
+ Low viscosity
+ Easy to apply
Mix Ratio by weight : 100:100 / Resin:Hardener
Operating Temperature: -60 to 115 °C
Typical Applications:
Automotive, Medical, Aerospace, Photonic, Assembly, industries, Also can be used anywhere that requires excellent chemical fastening to plastic parts.
- UNCURED PROPERTIES:
Viscosity @ 25 °C: 3,400
Specific Gravity, mixed: 1.19
Reactive solids contents, %: 100
Pot Life : 60 minutes
- CURE SCHEDULE:
1 hour @ 65°C
24 hours @ 25°C
- CURED PROPERTIES:
Glass transition temperature (Tg), °C: 10
Hardness, Shore D: 65
Lap shear strength, psi: 2400 (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Flexible Silver Epoxy, Cold Solder, Electrically Conductive Adhesive, Circuits, Electrical Modules, Wave Guides, Flat Cable & High Frequency Shields Repair Kit 916, 10gm
- PRODUCT DESCRIPTION:
AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.
AA-DUCT 916 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.
AA-DUCT 916 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, wave guides, flat cable and high frequency shields.
- PRODUCT DESCRIPTION:
Appearance Silver
Cure Type Heat cure or Room temperature
Benefits:
+ High strength
+ Perfect bond
+ Cold solder for heat sensitive components
Mix Ratio by weight 100:115 / Resin:Hardener
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps Paste
Specific Gravity, mixed 2.85
Reactive solids contents, % 100
Pot Life 3 hours
Shelf life 1 year
- CURED PROPERTIES:
Hardness, Shore D 64
Volume Resistivity ohm. cm
High Impact Epoxy, Two Part Adhesive, Medium Viscosity, AA-BOND 2135 , 100gm kit
This is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact strength properties are required. This superior, two-part adhesive is easily mixed and handled at room temperature, and develops strong, tough, high performance bonds to metals, ceramics, wood, concrete, phenolics, polyesters, epoxies, many urethanes and other plastics, and to many other materials. Fully cured this product is a tough, durable, electrically insulating adhesive with excellent mechanical, impact and shock resistance properties. In addition, it provides good resistance to gases, vapors, weather, water, petroleum solvents, anti-icing fluids, salt solutions, many mild acids and alkalis, and many other organic materials. Easy mix pre-measured pouch. Simple mix and use without any mess.
Thermally Conductive Epoxy Adhesive, Electrically Insulating Bond, Fiber Optic Bundles, Potting Glass, Fibers & Fiber Optic Connectors 2 Part 2156, 2.5gm Repair Kit
- PRODUCT DESCRIPTION:
AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
- GENERAL PROPERTIES:
• Appearance: Tan
• Cure Type: Room temperature or Heat cure
• Benefits:
o Fast cure
o Strong
o Durable
o High- impact bonds at room temperature that improves heat
• Mix Ratio by weight 100:23 / Resin:Hardener
• Operating Temperature -70 to 100 °C
• Typical Applications Fiber optic bundles, potting glass fibers and fiber optic connectors
- UNCURED PROPERTIES:
• Viscosity @ 25 °C 12,000 ±1000 (After Mixing)
• Specific Gravity, mixed 2.26
• Reactive solids contents, % 100
• Pot Life 5 minutes
- CURE SCHEDULE:
• 1 hour @ 25°C
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C: 33
• Hardness, Shore D: 79
• Lap shear strength, psi: 3400 (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Epoxy Adhesive Optically Clear, Low Viscosity High Impact Potting, 2 part, AA-BOND F117, 250gm Jar
This is an optically clear, low viscosity, high impact epoxy adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses, and prisms, LED displays, and other optical components. It is recommended for laminating, bonding, and sealing applications where excellent wetting, good pot life and improved impact strength properties are required. This two part adhesive is easily mixed and cured at room temperature, and develops strong, tough bonds to glass and glass fibers, ceramics, many metals, and most rigid plastics. This product bonds offer resistance to mechanical impact and thermal shock, and are also resistant to weather, water, gases and vapors, petroleum products, salts, and mild acids and alkalis. Easy mix pre-measured pouch. Simple mix and use without any mess.
Perfect Bond, Air Dry, Cold Solder, Nickel Epoxy, Electrically Conductive Adhesive, For RMI, EFI, Circuitry, Printed Circuit Board & Electronics Repair AA-DUCT 903, 2.5gm kit
- PRODUCT DESCRIPTION: AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 3.8 x10-2 ohm-cm. AA-DUCT 903 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties. AA-DUCT 903 has been used extensively in such diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. - GENERAL PROPERTIES: Appearance: Grey Cure Type: Heat cure or Room temperature Benefits: + High strength + Perfect bond + Cold solder for high-sensitive components Mix Ratio by weight 100:5 / Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical Applications Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair - UNCURED PROPERTIES: Viscosity @ 25 °C cps Paste Specific Gravity, mixed 2.79 Reactive solids contents, % 100 Pot Life 1 Hour Shelf Life 1 Year - CURED PROPERTIES: Hardness, Shore D 85 Shrinkage linear in/in 0.003 Tensile Strength, psi 9500 Volume Resistivity ohm. cm < 0.038 Thermal Expansion Coefficient, (cm / cm / °C * 10-5) 1.46 Compressive Strength, psi 14, 000 - CURE SCHEDULE: 15 minutes @ 100°C 45 minutes @ 50°C 24 hours Room temperature THERMAL CONDUCTIVITY: Thermal Conductivity, btu/hr/ft2/°F/in 100 Thermal Expansion Coefficient, (cm / cm / °C * 10-5) 1.5 Heat Distortions, °C 95 Operating Temperature Range, °C -50 to +170 GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages.
Milky Epoxy Solvent Free Passes NASA, Weather Resistant Adhesive For Critical Electronics, Aerospace, Industrial Applications Non-Sag Adhesive 2116, 100gm
- PRODUCT DESCRIPTION:
AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.
AA-BOND 2116 is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.
AA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.
- GENERAL PROPERTIES:
• Appearance Milky translucent
• Cure Type Room temperature or Heat Cure
• Benefits:
o Passes NASA's Outgassing/Low Outgassing
o Solvent free
o Weather resistant
• Mix Ratio by weight: 100:22.5 / Resin:Hardener
• Substrates:
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
• Operating Temperature: -60 to 130 °C
- UNCURED PROPERTIES:
• Specific Gravity : 1.25
• Reactive solids contents, %: 100
• Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
- MISC PROPERTIES:
Volume Resistivity: 6.00e+13 ohm-cm
Dielectric Constant: 4.5
Dielectric Strength: 410 kV/mil
Hardness, Shore D: 88
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA’s Outgassing For EMI RFI Shielding, Circuit Boards & Electronic Component N02, 50gm
- PRODUCT DESCRIPTION: AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly. AA-DUCT N02 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list. AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C. AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing. - PRODUCT DESCRIPTION: Base: Epoxy Appearance: Grey Cure Type: Heat cure or Room temperature Mix Ratio by weight: 100:6 / Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: -60 to 110 °C Viscosity @ 25 °C cps Soft: Paste Shelf Life: 6 months - CURED PROPERTIES: Hardness, Shore D: 88 Volume Resistivity ohm-cm: 3.8 x 10-2 - CURE SCHEDULE: 2 Hours @ 125 °C 1 hour @ 150°C 30 min @ 175 °C - THERMAL CHARACTERISTICS: Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1 Operating Temp. Range, °C: -55 to +175 - NASA OUTGASSING RESULTS: TML (Total Mass Loss): % 0.25 CVCM (Collected Volatile Condensable Materials): % 0.00 WVR (Water Vapor Recovery): % 0.07 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. - PRODUCT DESCRIPTION: AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive. AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry. - GENERAL INFORMATION: Appearance: Silver Coated ceramic %Silver coated ceramic: 76 Cure Type: Heat cure Benefits: - High strength - Perfect bond - EMI & RFI shielding - Wave guides Substrates: Excellent choice fo
Color coded Epoxy, High Temperature Adhesive, Fast Cure, Two Part, Fiber Optic Connectors Repair & Assembly, F123, 250gm
- PRODUCT DESCRIPTION:
AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connectors. Although this unique three-step color-change formulation unmixed components are light yellow, it turns light green on mixing, and changes again to a deep reddish-amber after the REQUIRED 100°C HIGH TEMPERATURE CURE. It exhibits good wicking, and develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that includes most metals, ceramics, glass and many plastics.
AA-BOND F123 has good impact and thermal shock resistance, and yields excellent low stress, pot-and-polish connections which do not piston during cycle tests. It is also resistant to water and weathering, vapors and gases, most petroleum products, and an extended range of organic and inorganic environments. Shorter cures at higher temperatures e.g. 2 minutes at 120°C or 1 minute at 150°C are also possible. An additional post-cure of 30 minutes at 150°C is recommended when application temperatures higher than 150°C are anticipated.
- GENERAL PROPERTIES:
+Color: Clear, Light Yellow Unmixed
Clear, Reddish-Brown Cured
+ Components 2 component - requires mixing
+ Mix Ratio by weight 100:10 / Resin:Hardener
+ Benefits
Low viscosity, Thermal shock and impact resistant, Low stress connections, Color coded
- Cure Type: Room temperature or Heat Cure
- Operating Temperature: -60 to 175 °C
- Typical Applications:
Fiber optic assembly, multimode. single mode connectors, small potting, and sealing applications.
- UNCURED PROPERTIES:
Viscosity At 25 °C : 2100
Specific Gravity: 1.19
Pot Life: 2 hours
- CURE SCHEDULE:
24 hours At 25°C
5 minutes At 100°C
- CURED PROPERTIES:
Glass Transition (Tg), ultimate, °C: 120
Hardness, Shore D 85
Refractive Index 1.54
Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
CALL (888) 522-6742 for more informations.
Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA’s Outgassing For EMI RFI Shielding, Circuit Boards & Electronic Component N02, 100gm
- PRODUCT DESCRIPTION: AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly. AA-DUCT N02 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list. AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C. AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing. - PRODUCT DESCRIPTION: Base: Epoxy Appearance: Grey Cure Type: Heat cure or Room temperature Mix Ratio by weight: 100:6 / Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: -60 to 110 °C Viscosity @ 25 °C cps Soft: Paste Shelf Life: 6 months - CURED PROPERTIES: Hardness, Shore D: 88 Volume Resistivity ohm-cm: 3.8 x 10-2 - CURE SCHEDULE: 2 Hours @ 125 °C 1 hour @ 150°C 30 min @ 175 °C - THERMAL CHARACTERISTICS: Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1 Operating Temp. Range, °C: -55 to +175 - NASA OUTGASSING RESULTS: TML (Total Mass Loss): % 0.25 CVCM (Collected Volatile Condensable Materials): % 0.00 WVR (Water Vapor Recovery): % 0.07 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. - PRODUCT DESCRIPTION: AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive. AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry. - GENERAL INFORMATION: Appearance: Silver Coated ceramic %Silver coated ceramic: 76 Cure Type: Heat cure Benefits: - High strength - Perfect bond - EMI & RFI shielding - Wave guides Substrates: Excellent choice f
Thermally Conductive Epoxy Adhesive Electrically Insulating Two Part Thixtropic AA-BOND 2153, 100grams
- PRODUCT DESCRIPTION: AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals. - GENERAL PROPERTIES: * Appearance Dark grey * Cure Type Room temperature or Heat Cure * Benefits: Strong Durable High impact bonds at room temperature Mix Ratio by weight 100:7 Resin: Hardener Operating Temperature -40 to 125 °C * Typical Applications: Staking transistors Diodes Resistors Integrated circuits and other heat-sensitive components to printed circuit boards - UNCURED PROPERTIES: * Specific Gravity, mixed 2.44 * Reactive solids contents, % 100 * Pot Life 30 minutes - CURE SCHEDULE: * 1-3 hours at 65°C * 24 hours at 25°C. - CURED PROPERTIES: * Glass transition temperature (Tg), °C 110 * Hardness, Shore D 88 * Dielectric strength, volts/mil 410
Good Electrical Insulation Epoxy, Smooth Paste Adhesive for Fiber Optic Connectors, Photonic & Electronic Applications, LED Displays, Lenses F162, 250gm
- PRODUCT DESCRIPTION:
AA-BOND F162 is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics.
AA-BOND F162 was specifically developed for fiber optic, laser, photonic and electronic applications requiring excellent electrical insulation in combination with effective thermal dissipation from heat-producing components.
AA-BOND F162 is two-part epoxy compound develops strong, durable, stable, high impact thermally conductive bonds at room temperature, and adheres readily to itself, and to metals, many plastics, silica, steatite, alumina, sapphire and other ceramics, glass, and to many other materials.
AA-BOND F162 provides excellent resistance to salt solutions, mild acids and alkalis and many other chemicals including petroleum solvents, lubricating oils and alcohol.
- GENERAL PROPERTIES:
• Appearance: Ligh grey/off white
• Cure Type: Room Temperature or Heat cure
• Benefits:
o Smooth paste
o Fiber optic
o Laser
o Photonic and electronic applications
o Good electrical insulation
• Mix Ratio by weight: 100:10 / Resin:Hardener
• Substrates: Metals, Many plastics, Glass, and other materials
• Operating Temperature: -60 to 120 °C
• Typical Applications: ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components.
• Max Temperature: 125 °C
- UNCURED PROPERTIES:
• Viscosity @ 25 °C: Paste
• Thixotropic Index: 1.0
• Specific Gravity, mixed, g/cc: 2.29
- CURE SCHEDULE:
• 2-4 hours @ 65°C
• 24 hours @ 25°C
- CURED PROPERTIES:
• Thermal Conductivity: 6.09 BTU-in/hr-ft²-°F
• Hardness, Shore D: 88
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
High Temp Epoxy, Fast Cure, Low Visc Adhesive, 2 part, Fiberoptics Adhesive, AA-BOND K5NA, 200gm
This is a three-part, ablative and thermally insulating epoxy compound used in aerospace applications. This smooth, trowellable system is specified by NASA for the Space Shuttle`s solid rocket boosters for close-out and patching of the boosters` thermal protection systems. It is also used for void filling and protecting wires, tubing and other surface protrusions on hypersonic re-entry bodies, nose cones and aircraft engines. This product is impact resistant which makes it an excellent choice for lightweight casting requirements. This product develops strong bonds to most all substrates. It maintains excellent dimensional stability over a wide temperature range and provides protection to weathering, ozone and moisture.
High Temp Adhesive Fast Cure, Low Visc Epoxy, 2 part, Fiberoptics Adhesive, AA-BOND K5NA, 50gm
This is a three-part, ablative and thermally insulating epoxy compound used in aerospace applications. This smooth, trowellable system is specified by NASA for the Space Shuttle`s solid rocket boosters for close-out and patching of the boosters` thermal protection systems. It is also used for void filling and protecting wires, tubing and other surface protrusions on hypersonic re-entry bodies, nose cones and aircraft engines. This product is impact resistant which makes it an excellent choice for lightweight casting requirements. This product develops strong bonds to most all substrates. It maintains excellent dimensional stability over a wide temperature range and provides protection to weathering, ozone and moisture. Easy mix pre-measured pouch. Simple mix and use without any mess.
Milky Epoxy Solvent Free Passes NASA, Weather Resistant Adhesive For Critical Electronics, Aerospace, Industrial Applications Non-Sag Adhesive 2116, 5gm
- PRODUCT DESCRIPTION:
AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.
AA-BOND 2116 is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.
AA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.
- GENERAL PROPERTIES:
• Appearance Milky translucent
• Cure Type Room temperature or Heat Cure
• Benefits:
o Passes NASA's Outgassing/Low Outgassing
o Solvent free
o Weather resistant
• Mix Ratio by weight: 100:22.5 / Resin:Hardener
• Substrates:
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
• Operating Temperature: -60 to 130 °C
- UNCURED PROPERTIES:
• Specific Gravity : 1.25
• Reactive solids contents, %: 100
• Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
- MISC PROPERTIES:
Volume Resistivity: 6.00e+13 ohm-cm
Dielectric Constant: 4.5
Dielectric Strength: 410 kV/mil
Hardness, Shore D: 88
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
Excellent Flow & Structural Bonding Epoxy Adhesive, No Sag for Vertical Applications & Overhead Surfaces, FS291 5gm
• PRODUCT DESCRIPTION:
AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics.
• GENERAL PROPERTIES:
Cure Type: Heat cure or Room temperature
Benefits:
o Excellent flow
o Excellent wetting characteristics
o Works on a wide variety of substrates
Mix Ratio by weight: 100:81 / Resin:Hardener
Substrates:
o Glass
o most metals
o variety of plastics
Typical Applications:
o Structural bonding
o Overhead and vertical applications
Pot Life: 45 minutes
• CURE SCHEDULE:
o 1 hour at 65°C
o 24 hours at 25°C
• MISC PROPERTIES:
Volume Resistivity: 2.70e+13 ohm-cm
Hardness, Shore D: 78
Lap shear: 3300 psi (Alum to Alum)
• GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
• AVAILABILITY:
This epoxy can be supplied in various different packages
Call (888) 522-6742 For More Informations.
Heat Resistant Epoxy Adhesive, 1:1 Mixing, Weather Resistant, Staking Components, Bonding, Laminating & Repair Applications Glue 28, 250gm
- PRODUCT DESCRIPTION:
AA-BOND 28 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength.
AA-BOND 28 contains a thixotrophic agent which impedes thinning out of the material during heat cure when properly mixed and cured.
- GENERAL PROPERTIES
• Appearance Amber
• Cure Type Room temperature or Heat Cure
• Operating Temperature: -60 to 163 °C
• Mix Ratio by weight 100:100 / Resin:Hardener
• Typical Application(s):
Staking components, bonding, laminating and repair applications
• Benefits:
o Room temperature or Heat Cure
o Tough enamel like cure
o Bonds to a variety of substrates
o Weather resistant
• Substrates:
o Metals
o Glass
o Ceramics
o Wood and many plastics
- UNCURED PROPERTIES:
Specific Gravity, mixed 1.07
Reactive solids contents, % 100
Pot Life 60 minutes
- CURE SCHEDULE:
• 4 to 6 hours @ 65°C
• 24 hours @ 25°C
- MISC PROPERTIES:
• Shelf Life 2 years closed packaging
• Glass Transition Temp, Tg 93°C
• Hardness, Shore D 78
• Lap shear 2900 psi (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
