High strength Silver Epoxy, Electrically Conductive for microwave, EMI & FRI shielding assembly & PCB, electronic component manufacturing & Repair 904
- PRODUCT DESCRIPTION:
AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly.
AA-DUCT 904 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175°C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication.
AA-DUCT 904 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.
AA-DUCT 904 is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping techniques. It is available in both a lower and higher viscosity grade for use in a variety of dispensing equipment and application techniques.
- CURED PROPERTIES:
Hardness, Shore D 83
- PRODUCT PROPERTIES:
Appearance Silver
Cure Type Heat cure
Benefits:
+ High strength
+ Excellent mechanical, electrical properties
Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass,
phenolic and G-10 epoxy glass boards.
- CURE SCHEDULE:
2 hours @ 125°C
1 hour @ 150°C
1/2 hours @ 175°C
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps: 200,000
Shelf life: 6 Months
Density: 3.6
- THERMAL PROPERTIES:
Thermal Conductivity, btu/hr/ft2/°F/in 16.1
Coefficient of Thermal Expansion 60x 10^-6 (in/in) C
Operating Temperature:
+ -55°C to +175°C
+ Intermit. to 325
- ELECTRICAL PROPERTIES:
Volume Resistivity ohm. cm 0.001
- NASA OUTGASSING RESULTS:
TML (Total Mass Loss) % 0.38
CVCM (Collected Volatile Condensable Materials) % 0.01
WVR (Water Vapor Recovery) % 0.07
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
This epoxy can be supplied in various different packages.
Super Electrically Conductive Silver Epoxy For Microwave EMI & RFI, Wave Guides, PCB, IC, Electronic Modules, Flat Cable, One Part, 905-100gm
- PRODUCT DESCRIPTION:
AA-DUCT 905 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
AA-DUCT 905 shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state.
AA-DUCT 905 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
AA-DUCT 905 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry. This Epoxy is designed for screening and micro product adhesion applications.
- PRODUCT PROPERTIES:
Appearance : Silver
Cure Type: Heat cure
Benefits:
• High strength
• Perfect bond
• EMI & RFI shielding
• Wave guides
Substrates:
• Integrated Circuits
• Aluminum
• Copper
• Magnesium
• Steel
• Bronze
• Nickel
• Kovar
• Ceramic
• Glass
• Phenolic
• G-10 epoxy glass boards.
Catalyst: Anhydride
Hardness, Shore D: 83
- AVAILABILITY:
This epoxy can be supplied in many different packages.
CALL (888) 522-6742 for more informations.
High Strength Epoxy Adhesive, Perfect Bond Glue For Printed Circuit Boards, Wave Guides, Electronic Modules, Flat Cable, Static, EMI & RFI Shielding,
- PRODUCT DESCRIPTION:
AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive.
AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry.
- GENERAL INFORMATION:
Appearance: Silver
Coated ceramic %Silver coated ceramic : 76
Cure Type: Heat cure
Benefits:
- High strength
- Perfect bond
- EMI & RFI shielding
- Wave guides
Substrates: Excellent choice for the Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Catalyst: Anhydride
- CURED PROPERTIES:
Sheet Resistivity:
Rigid Laminating, Sealing & Bonding Applications, Good Wetting, Great Mechanical & Electrical Properties, Medium Viscosity Epoxy Adhesive 2103, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND 2103 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting and improved mechanical electrical properties is required. AA-BOND 2103 is two-part liquid epoxy adhesive contains no solvents and is easy to mix, use and apply at room temperature.
AA-BOND 2103 develops strong, rigid, high performance bonds to itself and to ceramics, glass and glass fabrics, metals, laminates and other composite materials, forestry and masonry products, and to most rigid plastics.
AA-BOND 2103 is an effective electrical insulator, and further provides excellent resistance to weather, galvanic action, vapors, JP4 fuel, gasoline, lubricants and other petroleum products, mild acids and alkalis, salts, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Slight haze/Clear
Cure Type: Room temperature or Heat Cure
- Benefits:
Good wetting
Great mechanical properties
Great electrical properties
Solvent free
Easy mix and apply
Mix Ratio by weight 100:25 / Resin:Hardener
- Substrates:
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
- Operating Temperature: 60 to 125 °C
- UNCURED PROPERTIES:
Specific Gravity 1.2
Reactive solids contents, % 100
Pot Life 20 minutes
- CURE SCHEDULE:
4 hours at 65°C
24 hours at 25°C
- MISC PROPERTIES:
Volume Resistivity 6.00e+13 ohm-cm
Dielectric Constant 4.1Dielectric Strength 420 kV/in
Hardness, Shore D 85
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
High Impact Adhesive, Two Part Epoxy, Medium Viscosity, AA-BOND 2135, 2.5gm kit
This is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact strength properties are required. This superior, two-part adhesive is easily mixed and handled at room temperature, and develops strong, tough, high performance bonds to metals, ceramics, wood, concrete, phenolics, polyesters, epoxies, many urethanes and other plastics, and to many other materials. Fully cured this product is a tough, durable, electrically insulating adhesive with excellent mechanical, impact and shock resistance properties. In addition, it provides good resistance to gases, vapors, weather, water, petroleum solvents, anti-icing fluids, salt solutions, many mild acids and alkalis, and many other organic materials.
Clear Epoxy, High Impact, Low Viscosity Adhesive for Fiber Optic Assembly, Small Potting & Sealing Applications, Multimode & Single Mode Connectors, 2
- PRODUCT DESCRIPTION:
AA-BOND F113 is an Optically Clear, low viscosity , High impact epoxy adhesives developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, and other optical components.
AA-BOND F113 is recommended for laminating, bonding, and sealing applications where excellent wetting, good pot life and improved impact strength properties are required.
AA-BOND F113 is two parts adhesive easily mixed and cured at room temperature and develops strong bond to glass and glass fibers, ceramics, many metals and most rigid plastics.
AA-BOND F113 bonds offer resistance to mechanical impact and thermal shock, and is also resistant to weather, water, gases and vapors, petroleum products, and mild acids and alkalis.
- GENERAL PROPERTIES:
Appearance: Clear
Components: 2 component - requires mixing
Mix Ratio by weight: 100:30 / Resin:Hardener
Benefits: Low viscosity
Thermal shock and impact resistant
Low stress connections
Cure Type: Room temperature or Heat Cure
Operating Temperature: -60 to 120 °C
Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications
- UNCURED PROPERTIES:
Viscosity @ 25 °C: 175
Thixotropic Index: 1.0
Specific Gravity: 1.23
Pot Life: 1.5 hours
- CURE SCHEDULE:
24 hours @ 25°C
1-2 hours @ 65°C
- CURED PROPERTIES:
Coefficient of Thermal Expansion, cm/cm/ºC: 6.20×10+01
Glass Transition Temperature (Tg), ultimate, °C: 102
Hardness, Shore D: 86
Refractive Index: 1.51
Water Absorption , after 24 hours saturation, %: 0.07
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Metal Repair Epoxy Adhesive, Steel filled, High Performance, AA-BOND FS313, 5 gm pouch
PRODUCT DESCRIPTION:
This Product is steel epoxy, tooling resin features a highly filled, low viscosity composition for low shrinkage,can be easily drilled, tapped, polished, milled, sawed, or turned on a lathe, with conventional metal-working tools. This unique resin system is recommended for the fabrication of metal and vacuum form molds, hammer forms, drop hammer dies, foundry patterns, master molds, core filling, draw and stretch dies, lay-up molds, etc. Easy mix pre-measured pouch. Simple mix and use without any mess.
High Strength Epoxy Adhesive, Perfect Bond Glue For Printed Circuit Boards, Wave Guides, Electronic Modules, Flat Cable, Static, EMI & RFI Shielding,
- PRODUCT DESCRIPTION:
AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive.
AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry.
- GENERAL INFORMATION:
Appearance: Silver
Coated ceramic %Silver coated ceramic : 76
Cure Type: Heat cure
Benefits:
- High strength
- Perfect bond
- EMI & RFI shielding
- Wave guides
Substrates: Excellent choice for the Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Catalyst: Anhydride
- CURED PROPERTIES:
Sheet Resistivity:
One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 250 gm kit
+ PRODUCT DESCRIPTION:
AA-DUCT 907 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm•cm.
AA-DUCT 907 is also characterized by a wide operating temperature range from –50 to +170°C. AA-DUCT 907 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
+ PRODUCT PROPERTIES:
- Appearance: Silver
- Cure Type: Heat cure or Room temperature
- Benefits:
* High strength
* Perfect bond
* Cold solder for heat-sensitive components
- Mix Ratio by weight 100:100 / Resin:Hardener
- Substrates:
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- Operating Temperature: –50 to +170°C
- Typical Applications:
Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
+ UNCURED PROPERTIES:
- Specific Gravity, mixed: 2.79
- Reactive solids contents, %: 100
- Pot Life: 1Hour
- Shelf Life: 6 months
- Viscosity: Paste
+ CURE SCHEDULE:
15 minutes @ 100°C
45 minutes @ 50°C
24 hours @ Room temperature
+ CURED PROPERTIES:
- Hardness, Shore D: 85
- Shrinkage linear in/in: 0.0003
- Lap shear strength, psi: 9400
- Volume Resistivity ohm. cm :< 0.0001
- Thermal Expansion Coefficient, (cm / cm / °C • 10-5): 1.5
- Thermal Conductivity, btu / hr / ft2 / °F / in: 100
- Tensile Strength, psi: 9500
- Compressive Strength, psi: 14,000
- Heat Distortion, °C: 95
- Electrical Resistivity : < 1x10 -4 ohm•cm
+ GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
+ AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Perfect Bond Silver Epoxy, For Electronic Modules, PCB, Integrated Circuits, Capacitors, Wave Guides & Flat Cables, Electrically Conductive Adhesive,
- PRODUCT DESCRIPTION:
AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature range (up to 190°C) are required.
AA-DUCT 2924 is smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It can be used -- after REQUIRED high temperature cure cycle -- for the assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for high-frequency RF shielding, and for applications where a "hot" soldering iron is impractical.
When cured AA-DUCT 2924 is a hard, dimensionally stable, conductive material which is resistant to water, weathering, gases and vapors, lubricants, fuels, alcohol, and also to those salts, salt solutions, mild acids and alkalis, and other organic and inorganic compounds with which silver itself is compatible.
- GENERAL PROPERTIES:
Appearance: Silver
Cure Type: Heat cure
Benefits:
+ High strength
+ Perfect bond
+ Mix Ratio by weight: 100:5 / Resin:Hardener
Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature: -60 to 190 °C
Shelf Life: 1 Year
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps: Paste
Specific Gravity, mixed: 2.69
Reactive solids contents, %: 100
Pot Life: 3 hours
- CURE SCHEDULE:
2 hours: @ 125 °C
4 hours: @ 100 °C
- MISC PROPERTIES:
Hardness, Shore D: 85
Adhesive bond strength: 1270 psi
Volume Resistivity ohm-cm: < 0.003
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
High Temperature Adhesive, Fast Cure Epoxy, Low Viscosity For Photographic Industry, Fiber Optics, Laminating, Production & Repair Applications 2 Part
- PRODUCT DESCRIPTION:
AA-BOND F156 is a black, solvent free thixotropic epoxy recommended for high quality photographic industry, laminating, production and repair applications where a room temperature cure optically opaque adhesive for light sensitive components is required.
AA-BOND F156 is two parts smooth paste formulation is easy to use, develops strong bonds to itself and to most materials.
AA-BOND F156 exhibits low shrinkage during cure, has excellent dimensional stability over a wide temperature range.
- GENERAL PROPERTIES:
• Appearance: Black
• Cure Type: Room Temperature or Heat cure
• Benefits:
o Easy to use
o Good low-temperature structural, physical and electrical properties
o It’s resistant to water, weather, gases, salts, mild acids, alkalis, and many organic and inorganic compounds
• Mix Ratio by weight: 100:12 / Resin:Hardener
• Substrates: Glass and glass fabrics, ceramics, leather, metals and many plastics
• Operating Temperature: -60 to 130 °C
• Typical Applications: High quality photographic industry bonding, laminating, production and repair applications where a room-temperature cure optically opaque adhesive for light sensitive components is required.
- UNCURED PROPERTIES:
• Viscosity @ 25 °C, cps 50,000 After mixing
• Specific Gravity, mixed, g/cc 1.57
• Pot life 30 minutes
• Reactive solids contents, % 100
- CURE SCHEDULE:
o 4 hours @ 65°C
o 24 hours @ 25°C
- CURED PROPERTIES:
o Glass transition temperature (Tg), °C 95
o Hardness, Shore D 90
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Laminating, Sealing & Bonding Applications, Wetting, Great Mechanical & Electrical Properties, Medium Viscosity Epoxy Adhesive Glue 2103, 5gm
- PRODUCT DESCRIPTION:
AA-BOND 2103 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting and improved mechanical electrical properties is required. AA-BOND 2103 is two-part liquid epoxy adhesive contains no solvents and is easy to mix, use and apply at room temperature.
AA-BOND 2103 develops strong, rigid, high performance bonds to itself and to ceramics, glass and glass fabrics, metals, laminates and other composite materials, forestry and masonry products, and to most rigid plastics.
AA-BOND 2103 is an effective electrical insulator, and further provides excellent resistance to weather, galvanic action, vapors, JP4 fuel, gasoline, lubricants and other petroleum products, mild acids and alkalis, salts, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Slight haze/Clear
Cure Type: Room temperature or Heat Cure
- Benefits:
Good wetting
Great mechanical properties
Great electrical properties
Solvent free
Easy mix and apply
Mix Ratio by weight 100:25 / Resin:Hardener
- Substrates:
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
- Operating Temperature: 60 to 125 °C
- UNCURED PROPERTIES:
Specific Gravity 1.2
Reactive solids contents, % 100
Pot Life 20 minutes
- CURE SCHEDULE:
4 hours at 65°C
24 hours at 25°C
- MISC PROPERTIES:
Volume Resistivity 6.00e+13 ohm-cm
Dielectric Constant 4.1Dielectric Strength 420 kV/in
Hardness, Shore D 85
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Clear Epoxy Solvent Free, Low Viscosity, Good Wetting, For Fiber Optic, Electronic, Aerospace, Laminating & Bonding 2113, 5gm
- PRODUCT DESCRIPTION:
AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to glass, ceramics, most metals and many plastics.
AA-BOND 2113 is particularly recommended for assembly and repair work of fiber optic and other high performance electronic and aerospace systems and components, and for structural laminating applications where an initial low viscosity and near transparent "color" are needed.
AA-BOND 2113 is a good electrical insulator, provides excellent resistance to weather, galvanic action, salt solutions and many other chemicals including mild acid and alkalis, petroleum solvents, lubricating oils, jet fuels and gasoline, and alcohol.
- GENERAL PROPERTIES:
• Appearance Clear transparent
• Cure Type Room temperature or Heat Cure
• Benefits:
o Good wetting
o Solvent free
o Excellent flowability
o Adheres strongly to numerous substrates
• Mix Ratio by weight: 100:11 / Resin:Hardener
• Substrates:
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
• Operating Temperature: -60 to 130 °C
- UNCURED PROPERTIES:
• Specific Gravity: 1.15
• Reactive solids contents, %: 100
• Pot Life: 30 minutes
- CURE SCHEDULE:
• 4 hours @ 65°C
• 24 hours @ 25°C
- MISC PROPERTIES:
• Volume Resistivity: 6.00e+13 ohm-cm
• Dielectric Constant: 4.2
• Dielectric Strength: 410 volts/mil
• Hardness, Shore D: 88
• Dissipation factor: 0.020
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
FDA Epoxy Class VI Approved 1:1 Mixing For Bonding, Laminating & Repair Applications, Food Preparation, Processing & Packaging Equipment FDA2, 5gm
PRODUCT DESCRIPTION: AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval. AA-BOND FDA2 is two part amber adhesive used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment and devices. AA-BOND FDA2 provides low permeability to gases and vapors, and good resistance to water, weather, petroleum solvents, lubricants, to mild acids and alkalis, and to many other organic and inorganic compounds. GENERAL PROPERTIES: Appearance: Amber Cure Type: Heat cure or Room Temperature Benefits: o Medium viscosity o Class VI approved o Easily mixed o Low permeability o Good resistance Mix Ratio by weight: 100:100 / Resin: Hardener Substrates: Most metals, ceramic, glass and plastics Operating Temperature: -70 to 145 °C Typical Applications: Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices. Minimum Service Temperature, Air -94 °F UNCURED PROPERTIES: Viscosity @ 25 °C: 14, 000 ±2000 Specific Gravity, mixed: 1.11 Reactive solids contents, %: 100 Pot Life: 45 minutes CURE SCHEDULE: 1-4 hours @ 65°C 24 hours @ 25°C CURED PROPERTIES: Glass transition temperature (Tg), °C: 54 Hardness, Shore D: 79 Dielectric strength volts/mil: 420 Water Absorption, %:. 004 Lap shear strength, psi: 2700 (Aluminum to Aluminum) GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 For More Informations.
High Impact Epoxy, Two Part Adhesive, Medium Viscosity, AA-BOND 2135, 5gm kit
This is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact strength properties are required. This superior, two-part adhesive is easily mixed and handled at room temperature, and develops strong, tough, high performance bonds to metals, ceramics, wood, concrete, phenolics, polyesters, epoxies, many urethanes and other plastics, and to many other materials. Fully cured this product is a tough, durable, electrically insulating adhesive with excellent mechanical, impact and shock resistance properties. In addition, it provides good resistance to gases, vapors, weather, water, petroleum solvents, anti-icing fluids, salt solutions, many mild acids and alkalis, and many other organic materials. Easy mix pre-measured pouch. Simple mix and use without any mess.
FDA Medical Grade Adhesive, Low Permeability & Viscosity Epoxy, Good Resistance, Electrical Insulator for Bonding & Coating Applications 2 Part, FDA15
- PRODUCT DESCRIPTION:
AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration Chapter 1, Sub Part B, Sections 175.105 and 175.300.
AA-BOND FDA15 is two-part adhesive is used for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
AA-BOND FDA15 is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and inorganic compounds.
- GENERAL PROPERTIES:
• Appearance Clear
• Cure Type Heat cure or Room temperature
• Benefits:
* Low viscosity
* Good resistance
* Effective electrical insulator
* Low permeability
Mix Ratio by weight 100:20 / Resin:Hardener
• Substrates:
* Most metals
* Ceramic
* Glass and plastics
* Operating Temperature -60 to 140 °C.
- Typical Application:
Developed for bonding and coating applications.
- UNCURED PROPERTIES:
Viscosity At 25 °C 4,300 Thixotropic Index 1.0 Specific Gravity, mixed 1.16 g/cc Reactive solids contents, % 100Pot Life 25 minutes.
- CURE SCHEDULE:
• 1-4 hours At 65°C
• 24 hours At 25°C.
- CURED PROPERTIES:
Glass transition temperature (Tg), °C 100 Hardness, Shore D 87Water Absorption, % 0.23Dielectric strength, Volts/mil 420Lap shear strength, psi 2000 (Alum to Alum).
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
Call (888) 522-6742 For More Informations.
Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm
- PRODUCT DESCRIPTION:
AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.
AA-BOND FDA2T is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, lubricants and fuels, to mild acids and alkalis, and many other organic and inorganic compounds.
- PRODUCT PROPERTIES:
Appearance: Amber
Cure Type: Heat cure or Room Temperature
Benefits:
Medium viscosity
Electrically Insulating
Low permeability to gases and vapors
Low temperature cure
Mix Ratio by weight: 100:93 / Resin: Hardener
Typical Applications: Medical, Food preparation processing and packaging
- UNCURED PROPERTIES:
Viscosity @ 25 °C, cps: 25000 ±1000
Specific Gravity, mixed: 1.119
Pot Life: 3 hours
- CURE SCHEDULE:
1 to 4 Hours @ 65°C
24 Hours @ 25°C
- THERMAL PROPERTIES:
CTE, linear: 29.4 µin/in-°F @ temperature 68 °F
Glass Transition Temp, Tg: 70.0 °C, 158 °F
Operating Temperature :-70 to 145 °C
- CURED PROPERTIES:
Coefficient of Thermal Expansion, cm/cm/ºC: 5.30×10-05
Hardness, Shore D: 79
Elongation at Yield: 9.0 %
Adhesive Bond Strength :1800 psi
- ELECTRICAL PROPERTIES:
Volume Resistivity: 1.20e+14 ohm-cm
Dielectric Constant: 3.4 @ frequency 1000 Hz
Dielectric Strength: 420 kV/in
Dissipation Factor: 0.020
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
FDA Medical Grade Epoxy Electrical Insulator, 1:1 Mixing For Food Packaging & Processing 2 Part, FDA8, 5gm
PRODUCT DESCRIPTION: AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U. S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300. PRODUCT PROPERTIES: Appearance Amber Cure Type Heat cure or Room Temperature Benefits: + Low viscosity + easily mixed + effective electrical insulator + low permeability to gasses and vapors Mix Ratio by weight: 100:100 / Resin: Hardener Typical Applications: FDA Grade Applications, food packaging, indirect contact with food and medical applications UNCURED PROPERTIES: Viscosity @ 25 °C, cps: 1, 500 (After Mixing) @ temperature 77.0 °F, 25.0 °C Thixotropic Index: 1.0 Specific Gravity, mixed: 1.11 Reactive solids contents, %: 100 Pot Life: 45 minutes CURE SCHEDULE: 4 Hours @ 65°C 24 Hours @ 25°C CURED PROPERTIES: Hardness, Shore D 65 Dielectric strength volts/mil 410 ELECTRICAL PROPERTIES: Volume Resistivity 1.00 e+14 ohm-cm Dielectric Constant 3.35 @ frequency 1000 Hz THERMAL PROPERTIES: Operating Temperature -70 to 145 °C CTE, linear 29.4 µin/in-°F @ temperature 68.0 ° GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 For More Informations.
Pure Silver Conductive Epoxy, Maximum Continuity Of Conductivity For Rear Window Defroster Repair, Grid Repair, Cold Solder, Electronic Bonding, Or Se
Window Defroster Grid Repair Kit:
The Window Defroster Grid Repair kit is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm.cm. Our Defroster/Window Grid Repair kit is also characterized by a wide operating temperature range from –50 to +170°C.
This Defroster/Window Grid Repair kit is recommended for grid repair, electronic bonding, or sealing applications that require both fine electrical and mechanical properties. It can Substrates also aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Put the measuring lead (Red) and the reference (Black) of the Multimeter on the damaged grid line at both ends, right where the grid connects with the wide bus bars. Move one probe--it doesn't matter which--to the center of the line. If you now read 6 volts, the scratch is not in between the two probes. If you read the same system voltage, 12 volts or so, the break is in between the old probe location and the new one.
Just move the probes until you find the location that has full system voltage spanning it. Now it's time to turn off the de¬froster grid and the ignition switch.
How To Repair The Defroster Tab:
Clean the tab and the contact area with the alcohol prep. Then apply activator to both surfaces and let it dry.
Apply the completely mixed adhesive kit to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
Press the tab onto the contact area. Hold it in place until the adhesive sets up, usually about two minutes. Wait 24 hours to use the defogger.
Defroster TABS:
The tabs located along the sides of the defroster connect the defroster electrically to the vehicles defrost circuit. One tab is the positive and the other ground. If a tab comes off the defroster this will mean total instantaneous failure of the defroster.
Our kit is an epoxy adhesive. To use, carefully clean and dry all surfaces to be bonded from all dirt, dust, debris and handprints from the rear window.
Apply the completely mixed adhesive kit to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
Misc Properties:
Hardness, Shore D 83
Shrinkage linear in/in 0.003
Lap shear strength, psi 9400
Volume Resistivity ohm cm = 0.0001
Cure Schedule:
2 minutes @ 120°C
5 minutes @ 100°C
12 hours @ 25°C
General Properties:
Cure Type Heat Cure or Room Temperature
Benefits:
+ High strength
+ Perfect bond
+ Cold solder replacement
Mix Ratio 100:7 Resin:Hardener
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
General Prupose Epoxy Casting, Versatile Formula Adhesive, AA-CAST 156, 5gm kit
PRODUCT DESCRIPTION:
This is an easy-to-use, low cost, versatile epoxy resin and hardener system developed for general purpose casting applications. It develops excellent adhesion to most metals, plastics, and ceramics, and is recommended for electrical and structural potting and encapsulating applications where the combination of good mechanical, thermal, electrical and RT Cure properties are required. Fully cured this product is a strong, tough, electrical insulator with high heat stability and a low thermal coefficient of expansion that provides successful performance over a wide temperature range. It is resistant to industrial environments that include water, weather, galvanic action, petroleum fuels, lubricants and solvents, gases and vapors, many mild acids and alkalis.
Call (888) 522-6742 For More Informations.
High Frequency Epoxy for Electrical Modules, Flexible Circuits, Switches, Wave Guides, Flat Cable, Cold Solder Assembly & Repair 2919, 2919, 50 gm kit
- PRODUCT DESCRIPTION:
AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.
This two-part, thixotropic adhesive of refined pure silver and epoxy resin components is free of solvents and copper or carbon additives. It develops resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.
AA-DUCT 2919 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields.
- PRODUCT DESCRIPTION:
Appearance: Silver
Cure Type: Room temperature or Heat cure
Benefits:
+Free of solvents and copper or carbon additives
+Coatings between many different and dissimilar substrates
+Mix Ratio by weight: 90:100 / Resin:Hardener
+Substrates: Metal
+Ceramics
+Glass
Thixotropic Index: 4.9
Typicall Application: Assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields
Electronic bonding, coating, and sealing applications
Can be used as a flexible "cold-solder"
- CURE SCHEDULE:
4 Hours: @ 65 °C
24 Hours: @ 25 °C
- UNCURED PROPERTIES:
Specific Gravity, mixed: 2.32 g/cc
Pot Life: 30 mins
Solid Content: 100%
Volatile Organic Compounds (VOC) Content: 24.41 g
Viscosity: 995000 cPs @ 25 °C
- MISC PROPERTIES:
Shelf Life: 1 Year
Hardness, Shore D: 80
Adhesives Bond Strength:
+ Lap shear, alum to alum: 90 psi in 24hrs @ 25 °C
+ 170 psi in 4hrs @ 65 °C
- ELECTRICAL PROPERTIES:
Volume Resistivity:
+ 0.00011 ohm-cm cured 4 hrs @ 65 °C
+ 0.0016 ohm-cm cured 24hrs @ 25 °C
- THERMAL PROPERTIES:
CTE, linear: 19.4 µin/in-°F @ 68 °F
Thermal Conductivity: 11.1 BTU-in/hr-ft²-°F
Operating Temperature: -60.0 °C to 110 °C
Glass Transition Temp, Tg: 4.00 °C, 39.2 °F
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS)
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
High Strength Perfect Bond Silver Epoxy Adhesive Glue For Cold Solder Circuitry, Electrical Conductive, RMI, EFI, PCB, & Electronic Repair 902, 500gm
+ PRODUCT DESCRIPTION:
AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm•cm.
AA-DUCT 902 is also characterized by a wide operating temperature range from –50 to +170°C. AA-DUCT 902 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
+ PRODUCT PROPERTIES:
- Appearance: Silver
- Cure Type: Heat cure or Room temperature
- Benefits:
* High strength
* Perfect bond
* Cold solder for heat-sensitive components
- Mix Ratio by weight 100:5 / Resin:Hardener
- Substrates:
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- Operating Temperature: –50 to +170°C
- Typical Applications:
Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
+ UNCURED PROPERTIES:
- Specific Gravity, mixed: 2.79
- Reactive solids contents, %: 100
- Pot Life: 1Hour
- Shelf Life: 1 Year
- Viscosity: Paste
+ CURE SCHEDULE:
15 minutes @ 100°C
45 minutes @ 50°C
24 hours @ Room temperature
+ CURED PROPERTIES:
- Hardness, Shore D: 85
- Shrinkage linear in/in: 0.0003
- Lap shear strength, psi: 9400
- Volume Resistivity ohm. cm :< 0.0001
- Thermal Expansion Coefficient, (cm / cm / °C • 10-5): 1.5
- Thermal Conductivity, btu / hr / ft2 / °F / in: 100
- Tensile Strength, psi: 9500
- Compressive Strength, psi: 14,000
- Heat Distortion, °C: 95
- Electrical Resistivity : < 1x10 -4 ohm•cm
+ GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
+ AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Good Wetting Epoxy, High Temperature, Fast Cure, Low Viscosity For Industrial & Sealing Applications, 2 Part, FS227, 10gm
- PRODUCT DESCRIPTION:
AA-BOND FS227 is a thixotropic polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting, toughness, and superior mechanical properties are required.
- GENERAL PROPERTIES
Appearance: Amber
Cure Type: Heat cure or Room temperature
Benefits:
+ High fill
+ Easy handling
+ Good wetting
+ Toughness
+ High temperature
+ Fast cure
+ Low viscosity
Operating Temperature: -60 to 110 °C
Substrates: Most material surfaces, including many metals, rigid plastics, glass, ceramics, leather, rubber, wood and concrete
- UNCURED PROPERTIES:
Viscosity @ 25 °C: 650
Specific Gravity, mixed: 1.12 g/cc
Pot Life: 75 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
- CURED PROPERTIES:
Volume Resistivity: 1.20e+14 ohm-cm
Dielectric Strength: 460 volts/mil
Glass Transition Temp, Tg: 70 °C
Dielectric Constant: 3.35 @ Frequency 1000 Hz
Hardness, Shore D: 75
Lap shear: 2500 psi (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
Highly Thermal Conductive Epoxy, Pure Diamond Adhesive For Extremely Sensitive Thermal Cooling Applications 2 Part RT, AA-SUPERTHERM 05, 1.5gm Pouch
PRODUCT DESCRIPTION:
AA-SUPERTHERM 05 is a thixotropic (smooth paste) Pure Diamond ultra-high thermally conductive epoxy two-part adhesive that develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
AA-SUPERTHERM 05 bonds readily to itself, and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range.
Fully cured AA-SUPERTHERM 05 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.
AA-SUPERTHERM 05 passes NASA`s outgassing specification making it ideal for demanding space applications.
PRODUCT PROPERTIES:
Appearance: Grey
Cure Type: Heat cure or Room temperature
Benefits:
+ Strong
+ Durable
+ High-impact bonds
+ Fully cured
+ Excellent resistance to many chemicals
Mix Ratio by weight: 100:100 / Resin:Hardener
Substrates:
metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials
Typical Applications:
Extremely sensitive thermal cooling applications
CURE SCHEDULE:
2 – 4 Hours: @ 65 °C
24 Hours: @ 25 °C
UNCURED PROPERTIES:
Viscosity @ 25 °C, 77.0 °F: 33,000 Cp @ 77.0 °F, 25.0 °C
Specific Gravity, mixed: 2.30 g/cc
Pot Life: 45 minutes
MISC PROPERTIES:
CTE, linear: 14.4 µin/in-°F@ RT
Hardness, Shore D: 90
Izod Impact, Notched: 0.490 ft-lb/in
ELECTRICAL PROPERTIES:
Volume Resistivity: 2.10e+15 ohm-cm
3.20e+13 ohm-cm @ 167 °F
Dielectric Constant: 5.9 @ 1000 Hz
Dielectric Strength: 410kV/in, 16.1 kV/mm
Dissipation Factor: 0.010 @ Frequency 1000 Hz
THERMAL PROPERTIES:
Thermal Conductivity: 7.36 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg: 48.0 °C, 118 °F
Maximum Service Temperature, Air: 115 °C, 239 °F
Minimum Service Temperature, Air: -70.0 °C, -94.0 °F
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
FDA Epoxy Medium Viscosity Class VI Approved Easily 1:1 Mixing For Catheters, Hearing Aids, Dental Products Biomedical Instruments & Devices FDA2, 2.5
PRODUCT DESCRIPTION:
AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.
AA-BOND FDA2 is two part amber adhesive used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment and devices.
AA-BOND FDA2 provides low permeability to gases and vapors, and good resistance to water, weather, petroleum solvents, lubricants, to mild acids and alkalis, and to many other organic and inorganic compounds.
GENERAL PROPERTIES:
Appearance: Amber
Cure Type: Heat cure or Room Temperature
Benefits:
o Medium viscosity
o Class VI approved
o Easily mixed
o Low permeability
o Good resistance
Mix Ratio by weight: 100:100 / Resin:Hardener
Substrates: Most metals, ceramic, glass and plastics
Operating Temperature: -70 to 145 °C
Typical Applications: Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
Minimum Service Temperature, Air -94 °F
UNCURED PROPERTIES:
Viscosity @ 25 °C: 14,000 ±2000
Specific Gravity, mixed: 1.11
Reactive solids contents, %: 100
Pot Life: 45 minutes
CURE SCHEDULE:
1-4 hours @ 65°C
24 hours @ 25°C
CURED PROPERTIES:
Glass transition temperature (Tg), °C: 54
Hardness, Shore D: 79
Dielectric strength volts/mil: 420
Water Absorption, %: .004
Lap shear strength, psi: 2700 (Aluminum to Aluminum)
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
Heat Resistant Epoxy Adhesive, 1:1 Mixing, Weather Resistant, Staking Components, Bonding, Laminating & Repair Applications Glue 28, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND 28 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength.
AA-BOND 28 contains a thixotrophic agent which impedes thinning out of the material during heat cure when properly mixed and cured.
- GENERAL PROPERTIES
• Appearance Amber
• Cure Type Room temperature or Heat Cure
• Operating Temperature: -60 to 163 °C
• Mix Ratio by weight 100:100 / Resin:Hardener
• Typical Application(s):
Staking components, bonding, laminating and repair applications
• Benefits:
o Room temperature or Heat Cure
o Tough enamel like cure
o Bonds to a variety of substrates
o Weather resistant
• Substrates:
o Metals
o Glass
o Ceramics
o Wood and many plastics
- UNCURED PROPERTIES:
Specific Gravity, mixed 1.07
Reactive solids contents, % 100
Pot Life 60 minutes
- CURE SCHEDULE:
• 4 to 6 hours @ 65°C
• 24 hours @ 25°C
- MISC PROPERTIES:
• Shelf Life 2 years closed packaging
• Glass Transition Temp, Tg 93°C
• Hardness, Shore D 78
• Lap shear 2900 psi (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
FDA Epoxy, Class VI Approved, 1:1 Mixing, For Bonding, Laminating & Repair Applications, Food Preparation, Processing & Packaging Equipment FDA2, 2.5g
PRODUCT DESCRIPTION:
AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.
AA-BOND FDA2 is two part amber adhesive used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment and devices.
AA-BOND FDA2 provides low permeability to gases and vapors, and good resistance to water, weather, petroleum solvents, lubricants, to mild acids and alkalis, and to many other organic and inorganic compounds.
GENERAL PROPERTIES:
Appearance: Amber
Cure Type: Heat cure or Room Temperature
Benefits:
o Medium viscosity
o Class VI approved
o Easily mixed
o Low permeability
o Good resistance
Mix Ratio by weight: 100:100 / Resin:Hardener
Substrates: Most metals, ceramic, glass and plastics
Operating Temperature: -70 to 145 °C
Typical Applications: Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
Minimum Service Temperature, Air -94 °F
UNCURED PROPERTIES:
Viscosity @ 25 °C: 14,000 ±2000
Specific Gravity, mixed: 1.11
Reactive solids contents, %: 100
Pot Life: 45 minutes
CURE SCHEDULE:
1-4 hours @ 65°C
24 hours @ 25°C
CURED PROPERTIES:
Glass transition temperature (Tg), °C: 54
Hardness, Shore D: 79
Dielectric strength volts/mil: 420
Water Absorption, %: .004
Lap shear strength, psi: 2700 (Aluminum to Aluminum)
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
Excellent Durability Adhesive, Heat & Impact Resistant FDA Epoxy, Medical Grade Medium Viscosity, FDA26, 5gm
- PRODUCT DESCRIPTION: AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food preparation, processing and packaging equipment and devices. - PRODUCT PROPERTIES: Appearance: Grey Cure Type: Heat cure or Room temperature Benefits: * Excellent durability * High shear and peel strength * Heat and impact resistant * Handy duo-pack cartridges for easy mixing Mix Ratio by weight: 100:14 / Resin: Hardener Substrates: Most metals, ceramic, glass and plastics Operating Temperatures: -60 to 135 °C - UNCURED PROPERTIES: Viscosity @ 25 °C, cps: 17, 500 ±1000 @ temperature 77 °F, 25 °C Specific Gravity, mixed: 2.36 Reactive solids contents, %: 100 Pot Life: 50 minutes - CURE SCHEDULE: 1-4 Hours: @ 65°C 24 Hours: @ 25°C - CURED PROPERTIES: * Adhesive Bond Strength, psi: o 2120 ( 1 hr @ 65°C) o 2190 (24 hrs @ 25°C) * Hardness, Shore D: o 86 (24 HR @ 25°C) o 90 (1 hr @ 65°C) - THERMAL PROPERTIES: Glass transition temperature (Tg): 113°C, 235 °F - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 For More Informations.
High Temperature Adhesive, Fast Cure Epoxy, Low Shrinkage & Viscosity, 2 Part Fiber Optic Connectors Assembly, Multimode & Single Mode Connectors F125
- PRODUCT DESCRIPTION:
AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications.
AA-BOND F125 is clear, two part system is easily mixed and used at room temperature. Fiber optic connectors can be polished in as little as 15 to 20 minutes for piston free assurance. The high bond strength of AA-BOND F125 to glass, plastics, ceramics, metals and masonry allows it to be used in a wide array of applications including lens bonding, connector backfills, construction, component assembly and maintenance repair.
AA-BOND F125 is low shrinkage epoxy, develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25°C is required for fully matured bonds.
NOTE: AA-BOND F125 develops a high exotherm. Use immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready before mixing.
- GENERAL PROPERTIES:
• Components: 2 component - requires mixing
• Mix Ratio by weight: 100:95 / Resin:Hardener
• Benefits:
o Low viscosity
o Fast Cure
o Low shrinkage
• Cure Type: Room temperature or Heat cure
• Operating Temperature :-60 to 100 °C
• Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications
- UNCURED PROPERTIES:
• Viscosity @ 25 °C:
o Resin: 9000cP
o Hardener: 14000cP
• Specific Gravity :1.19
• Pot Life: 5 minutes
- CURE SCHEDULE:
• 24 hours @ 25°C
• 1 hour @ 60°C
- CURED PROPERTIES:
• Glass Transition (Tg), ultimate, °C: 40
• Hardness, Shore D: 75
• Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Flexible Silver Epoxy, Cold Solder, Electrically Conductive Adhesive, Circuits, Electrical Modules, Wave Guides, Flat Cable & High Frequency Shields R
- PRODUCT DESCRIPTION:
AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.
AA-DUCT 916 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.
AA-DUCT 916 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, wave guides, flat cable and high frequency shields.
- PRODUCT DESCRIPTION
Appearance Silver
Cure Type Heat cure or Room temperature
Benefits High strength
Perfect bond
Cold solder for heat sensitive components
Mix Ratio by weight 100:115 / Resin:Hardener
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps Paste
Specific Gravity, mixed 2.85
Reactive solids contents, % 100
Pot Life 3 hours
Shelf life 1 year
- CURED PROPERTIES:
Hardness, Shore D 64
Volume Resistivity ohm. cm
High Impact Absorption Silver Epoxy, High Strength Adhesive, Electrically Conductive, Heat & Stress Resistance Applications, Cure Only, 1 Part 2979,
- PRODUCT DESCRIPTION:
AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability.
AA-DUCT 2979 has been shown to retain their properties through hundreds of hours of rapid temperature cycling and has also high impact absorption and stress resistance.
- PRODUCT PROPERTIES:
Appearance Silver
Cure Type Heat cure
Benefits:
+ High strength
+ Excellent mechanical, electrical properties
Substrates Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature -40°C to 175 °C
NASA Outgassing Passes
Thixotropic Index 3.4
Pot Life 6
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps 65,000 @ Temperature 77.0 °F
Shelf Life 6 months
Adhesive Bond Strength 1750 psi
Density 3.5
Thermal Conductivity, W/m.K 0.90
Coefficient of Thermal Expansion 57x 10^-6 (in/in) °C
Lap Shear Strength, PSI 9200
- CURE SCHEDULE:
10 minutes @ 150°C
1 hour @ 125°C
- CURED PROPERTIES:
Hardness, Shore D 86
Volume Resistivity ohm-cm 3 x 10-4
- ELECTRICAL PROPERTIES:
Glass Transition Temp, Tg 45.0 °C, 113 °F
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Durable Epoxy, Fast Cure, Medium Viscosity, Strong Bond Strength Adhesive, For General Purpose, Bonding, Laminating Repair 2101, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND 2101 is a clear medium viscosity epoxy formulation recommended for laminating, bonding, repair and other adhesive applications where the combination of superior structural, mechanical and electrical performance properties are required. AA-BOND 2101 easily mixes and cures at room temperature, and develops strong, durable, tough bonds to most clean, dry material surfaces.
The fully cured AA-BOND 2101 bonds are great electrical insulators which also provide excellent resistance to weather, galvanic action, many mild acids and alkalis, salt solution, petroleum solvents, lubricating oil, gasoline, jet fuels, alcohol, and many other organic and inorganic materials.
- GENERAL PROPERTIES:
• Appearance: Slight haze/Clear
• Cure Type: Room temperature or Heat Cure
• Benefits: Resistant to many organics/inorganics Strong bond strength Durable
• Mix Ratio by weight: 100:25 / Resin:Hardener
• Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics
• Operating Temperature: -60 to 135 °C.
- UNCURED PROPERTIES:
• Viscosity at 25 °C: 18500 cPs ±1000
• Solids Content 100%
• Specific Gravity, mixed 1.19 g/cc
• Pot Life 30 minutes.
- CURE SCHEDULE:
• 4 hours at 65°C
• 24 hours at 25°C.
- MISC PROPERTIES:
• Glass Transition Temp, Tg 62°C
• Hardness, Shore D 84
• Lap shear 3300 psi (Alum to Alum).
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
Electronic Industries Epoxy, Special Formulation Adhesive For PCB Components & Assembly, Aerospace, 2 Part, Thixotropic 2104, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties.
AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Milky translucent
Cure Type: Room temperature or Heat cure
Benefits:
* Great for Aerospace applications
* Great for reinforcing applications
* Bonds to many substrates
Mix Ratio by weight : 100:22 / Resin:Hardener
Substrates Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature: -40 to 125 °C
Typical Application(s):
PCB components, aerospace, anything where superior properties are required
- UNCURED PROPERTIES:
Solids Content: 100%
Specific Gravity, mixed: 1.19 g/cc
Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
MISC PROPERTIES:
Hardness, Shore D 88
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
Super Electrically Conductive Silver Epoxy For Microwave EMI & RFI Shielding, Wave Guides, PCB, Electronic Modules, One Part 905-10gm
- PRODUCT DESCRIPTION:
AA-DUCT 905 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
AA-DUCT 905 shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state.
AA-DUCT 905 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
AA-DUCT 905 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry. This Epoxy is designed for screening and micro product adhesion applications.
- PRODUCT PROPERTIES:
Appearance : Silver
Cure Type: Heat cure
Benefits:
• High strength
• Perfect bond
• EMI & RFI shielding
• Wave guides
Substrates:
• Integrated Circuits
• Aluminum
• Copper
• Magnesium
• Steel
• Bronze
• Nickel
• Kovar
• Ceramic
• Glass
• Phenolic
• G-10 epoxy glass boards.
Catalyst: Anhydride
Hardness, Shore D: 83
- AVAILABILITY:
This epoxy can be supplied in many different packages.
CALL (888) 522-6742 for more informations.
Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA’s Outgassing For EMI RFI Shielding,
- PRODUCT DESCRIPTION: AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly. AA-DUCT N02 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list. AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C. AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing. - PRODUCT DESCRIPTION: Base: Epoxy Appearance: Grey Cure Type: Heat cure or Room temperature Mix Ratio by weight: 100:6 / Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: -60 to 110 °C Viscosity @ 25 °C cps Soft: Paste Shelf Life: 6 months - CURED PROPERTIES: Hardness, Shore D: 88 Volume Resistivity ohm-cm: 3.8 x 10-2 - CURE SCHEDULE: 2 Hours @ 125 °C 1 hour @ 150°C 30 min @ 175 °C - THERMAL CHARACTERISTICS: Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1 Operating Temp. Range, °C: -55 to +175 - NASA OUTGASSING RESULTS: TML (Total Mass Loss): % 0.25 CVCM (Collected Volatile Condensable Materials): % 0.00 WVR (Water Vapor Recovery): % 0.07 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. - PRODUCT DESCRIPTION: AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive. AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry. - GENERAL INFORMATION: Appearance: Silver Coated ceramic %Silver coated ceramic: 76 Cure Type: Heat cure Benefits: - High strength - Perfect bond - EMI & RFI shielding - Wave guides Substrates: Excellent choice fo
Good Electrical Insulation Epoxy, Smooth Paste Adhesive for Fiber Optic Connectors, Photonic & Electronic Applications, LED Displays, Lenses F162, 250
- PRODUCT DESCRIPTION:
AA-BOND F162 is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics.
AA-BOND F162 was specifically developed for fiber optic, laser, photonic and electronic applications requiring excellent electrical insulation in combination with effective thermal dissipation from heat-producing components.
AA-BOND F162 is two-part epoxy compound develops strong, durable, stable, high impact thermally conductive bonds at room temperature, and adheres readily to itself, and to metals, many plastics, silica, steatite, alumina, sapphire and other ceramics, glass, and to many other materials.
AA-BOND F162 provides excellent resistance to salt solutions, mild acids and alkalis and many other chemicals including petroleum solvents, lubricating oils and alcohol.
- GENERAL PROPERTIES:
• Appearance: Ligh grey/off white
• Cure Type: Room Temperature or Heat cure
• Benefits:
o Smooth paste
o Fiber optic
o Laser
o Photonic and electronic applications
o Good electrical insulation
• Mix Ratio by weight: 100:10 / Resin:Hardener
• Substrates: Metals, Many plastics, Glass, and other materials
• Operating Temperature: -60 to 120 °C
• Typical Applications: ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components.
• Max Temperature: 125 °C
- UNCURED PROPERTIES:
• Viscosity @ 25 °C: Paste
• Thixotropic Index: 1.0
• Specific Gravity, mixed, g/cc: 2.29
- CURE SCHEDULE:
• 2-4 hours @ 65°C
• 24 hours @ 25°C
- CURED PROPERTIES:
• Thermal Conductivity: 6.09 BTU-in/hr-ft²-°F
• Hardness, Shore D: 88
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
High Strength Perfect Bond Cold Solder Epoxy Adhesive Glue Silver Filled For RMI EFI Shielding Electrically Conductive Long Pot Life Printed Circuit B
- PRODUCT DESCRIPTION:
AA-DUCT 902LP is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. AA-DUCT 902LP is also characterized by a wide operating temperature range from –50 to +170°C.
AA-DUCT 902LP is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
- GENERAL PROPERTIES:
Appearance: Silver
Cure Type: Heat cure or Room temperature
Benefits:
• High strength
• Perfect bond
• Cold solder for heat sensitive components
• Mix Ratio by weight 100/7 ( Resin/Hardener)
Substrates:
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature: -60 to 150 °C
Typical Applications:
Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
- UNCURED PROPERTIES:
Viscosity At 25 °C cps Paste
Specific Gravity, mixed 2.79
Reactive solids contents, % 100
Pot Life 3 hours
- CURE SCHEDULE:
2 minutes At 120°C
5 minutes At 100°C
12 hours At 25°C
- MISC PROPERTIES:
Hardness, Shore D 83
Shrinkage linear in/in 0.003
Lap shear strength, psi 9600
Volume Resistivity: ohm cm > 0.0001
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Gold Epoxy, 2 Part, Electrically & Thermally Conductive For Hybrid Circuits Joining Die & SMD, Au Thick Film Conductor Traces & Contact Pads, G298, 5g
PRODUCT DESCRIPTION:
AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.
GENERAL PROPERTIES:
Components: A & B
Appearance: Brown
Cure Type: Room temperature or Heat cure
Benefits:
+ Gold filled epoxy allows for anti-oxidation of Contacts and terminals in high reliability devices.
+ It can be used in medical circuits using traditional hybrid packaging technologies.
+ High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
+ Mix Ratio by weight: 100:13.5 / Resin:Hardener
+ Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics
+ Operating Temperature: Continuous: - 55°C to 275°C
+ Intermittent: - 55°C to 375°C
+ Typical Applications: Adhesive for joining die and SMDs onto the hybrid circuits
+ Repairing defective Au thick-film conductor traces and contact pads
+ Resisting oxidation and electro-migration in high-reliability micro-electronics
+ Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C
UNCURED PROPERTIES:
Viscosity @ 25 °C, mPa·s (cP): Paste
Pot Life: 30 mins
Shelf Life: 1 Year
CURE SCHEDULE:
15 minutes: @ 120°C
90 minutes: @ 80°C
10 hours: @ 50°C
24 hours: @ 25°C
MISC PROPERTIES:
Volume Resistivity: @ 23°C: = 0.0009 Ohm-cm
Glass Transition Temp, Tg: = 100°C (Dynamic Cure
20—200°C /ISO 25 Min; Ramp- 0—200°C @ 20°C/Min)
Die Shear Strength: @ 23°C: = 5 Kg / 1,700 psi
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Great Electrical Insulator General Purpose Epoxy, 1:1 Mixing, Fast Cure, Quick Dry, 2 Minute Epoxy, 201, 2.5gm pouch
- PRODUCT DESCRIPTION:
AA-BOND 201 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required.
AA-BOND 201 is versatile two-part epoxy system contains no solvents, mixes easily at room temperature, and is suitable for high performance structural bonding applications where the combination of very fast room temperature curing coupled with low shrinkage and excellent mechanical and electrical properties is needed.
AA-BOND 201 develops strong, tough bonds to metals, plastics, concrete, sheetrock, marbel, stone, rock, tile, plaster, cement, glass and glass fabrics, hardboards and forestry products, ceramics, rubber, masonry materials, and other construction materials.
AA-BOND 201 is an excellent electrical insulator, and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solutions, and many other organic and inorganic compounds.
AA-BOND 201 develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25°C is required for fully matured bonds.
Note: AA-BOND 201 develops a high exotherm. Please, use it immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready before mixing.
- GENERAL PROPERTIES:
* Appearance Slight haze/ slight straw
* Cure Type Room temperature or Heat cure
* Benefits:
Resistant to many organic/inorganics
Strong bond strength
Great electrical insulator
Durable
* Mix Ratio by weight 100:100 / Resin:Hardener
* Substrates:
metals, plastics, concrete, sheetrock, tile, marble, stone, rock, plaster,cement,glass fabrics, wood, leather and rigid plastics
Operating Temperature -60 to 110 °C
* Typical Application(s) Anything requiring the unique properties this adhesive offers
- UNCURED PROPERTIES:
* Viscosity @ 25 °C, mPa·s (cP) Thixotropic
* Solids Content 100%
* Specific Gravity, mixed 1.2 g/cc
- CURE SCHEDULE:
30 minutes @ 65°C
2 hours @ 25°C
- MISC PROPERTIES:
* Volume Resistivity 5.00e+11 ohm-cm
* Dielectric Constant 4.8
* Dielectric Strength 410kV/in
* CTE, linear 33.3 µin/in-°F@ RT
* Hardness, Shore D 70
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages
Color coded Epoxy, High Temperature Adhesive, Fast Cure, Two Part, Fiber Optic Connectors Repair & Assembly, F123, 2.5gm
- PRODUCT DESCRIPTION:
AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connectors. Although this unique three-step color-change formulation unmixed components are light yellow, it turns light green on mixing, and changes again to a deep reddish-amber after the REQUIRED 100°C HIGH TEMPERATURE CURE. It exhibits good wicking, and develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that includes most metals, ceramics, glass and many plastics.
AA-BOND F123 has good impact and thermal shock resistance, and yields excellent low stress, pot-and-polish connections which do not piston during cycle tests. It is also resistant to water and weathering, vapors and gases, most petroleum products, and an extended range of organic and inorganic environments. Shorter cures at higher temperatures e.g. 2 minutes at 120°C or 1 minute at 150°C are also possible. An additional post-cure of 30 minutes at 150°C is recommended when application temperatures higher than 150°C are anticipated.
- GENERAL PROPERTIES:
+Color: Clear, Light Yellow Unmixed
Clear, Reddish-Brown Cured
+ Components 2 component - requires mixing
+ Mix Ratio by weight 100:10 / Resin:Hardener
+ Benefits
Low viscosity, Thermal shock and impact resistant, Low stress connections, Color coded
- Cure Type: Room temperature or Heat Cure
- Operating Temperature: -60 to 175 °C
- Typical Applications:
Fiber optic assembly, multimode. single mode connectors, small potting, and sealing applications.
- UNCURED PROPERTIES:
Viscosity At 25 °C : 2100
Specific Gravity: 1.19
Pot Life: 2 hours
- CURE SCHEDULE:
24 hours At 25°C
5 minutes At 100°C
- CURED PROPERTIES:
Glass Transition (Tg), ultimate, °C: 120
Hardness, Shore D 85
Refractive Index 1.54
Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
CALL (888) 522-6742 for more informations.
High strength Silver Epoxy, Electrically Conductive for microwave, EMI & FRI shielding assembly & PCB, electronic component manufacturing & Repair 904
- PRODUCT DESCRIPTION:
AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly.
AA-DUCT 904 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175°C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication.
AA-DUCT 904 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.
AA-DUCT 904 is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping techniques. It is available in both a lower and higher viscosity grade for use in a variety of dispensing equipment and application techniques.
- CURED PROPERTIES:
Hardness, Shore D 83
- PRODUCT PROPERTIES:
Appearance Silver
Cure Type Heat cure
Benefits:
+ High strength
+ Excellent mechanical, electrical properties
Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass,
phenolic and G-10 epoxy glass boards.
- CURE SCHEDULE:
2 hours @ 125°C
1 hour @ 150°C
1/2 hours @ 175°C
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps: 200,000
Shelf life: 6 Months
Density: 3.6
- THERMAL PROPERTIES:
Thermal Conductivity, btu/hr/ft2/°F/in 16.1
Coefficient of Thermal Expansion 60x 10^-6 (in/in) C
Operating Temperature:
+ -55°C to +175°C
+ Intermit. to 325
- ELECTRICAL PROPERTIES:
Volume Resistivity ohm. cm 0.001
- NASA OUTGASSING RESULTS:
TML (Total Mass Loss) % 0.38
CVCM (Collected Volatile Condensable Materials) % 0.01
WVR (Water Vapor Recovery) % 0.07
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
This epoxy can be supplied in various different packages.
Perfect Bond, Air Dry, Cold Solder, Nickel Epoxy, Electrically Conductive Adhesive, For RMI, EFI, Circuitry, Printed Circuit Board & Electronics Repai
- PRODUCT DESCRIPTION: AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 3.8 x10-2 ohm-cm. AA-DUCT 903 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties. AA-DUCT 903 has been used extensively in such diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. - GENERAL PROPERTIES: Appearance: Grey Cure Type: Heat cure or Room temperature Benefits: + High strength + Perfect bond + Cold solder for high-sensitive components Mix Ratio by weight 100:5 / Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical Applications Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair - UNCURED PROPERTIES: Viscosity @ 25 °C cps Paste Specific Gravity, mixed 2.79 Reactive solids contents, % 100 Pot Life 1 Hour Shelf Life 1 Year - CURED PROPERTIES: Hardness, Shore D 85 Shrinkage linear in/in 0.003 Tensile Strength, psi 9500 Volume Resistivity ohm. cm < 0.038 Thermal Expansion Coefficient, (cm / cm / °C * 10-5) 1.46 Compressive Strength, psi 14, 000 - CURE SCHEDULE: 15 minutes @ 100°C 45 minutes @ 50°C 24 hours Room temperature THERMAL CONDUCTIVITY: Thermal Conductivity, btu/hr/ft2/°F/in 100 Thermal Expansion Coefficient, (cm / cm / °C * 10-5) 1.5 Heat Distortions, °C 95 Operating Temperature Range, °C -50 to +170 GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 for more information.
High Temperature Adhesive, Fast Cure Epoxy, Low Viscosity For Photographic Industry, Fiber Optics, Laminating, Production & Repair Applications 2 Part
- PRODUCT DESCRIPTION:
AA-BOND F156 is a black, solvent free thixotropic epoxy recommended for high quality photographic industry, laminating, production and repair applications where a room temperature cure optically opaque adhesive for light sensitive components is required.
AA-BOND F156 is two parts smooth paste formulation is easy to use, develops strong bonds to itself and to most materials.
AA-BOND F156 exhibits low shrinkage during cure, has excellent dimensional stability over a wide temperature range.
- GENERAL PROPERTIES:
• Appearance: Black
• Cure Type: Room Temperature or Heat cure
• Benefits:
o Easy to use
o Good low-temperature structural, physical and electrical properties
o It’s resistant to water, weather, gases, salts, mild acids, alkalis, and many organic and inorganic compounds
• Mix Ratio by weight: 100:12 / Resin:Hardener
• Substrates: Glass and glass fabrics, ceramics, leather, metals and many plastics
• Operating Temperature: -60 to 130 °C
• Typical Applications: High quality photographic industry bonding, laminating, production and repair applications where a room-temperature cure optically opaque adhesive for light sensitive components is required.
- UNCURED PROPERTIES:
• Viscosity @ 25 °C, cps 50,000 After mixing
• Specific Gravity, mixed, g/cc 1.57
• Pot life 30 minutes
• Reactive solids contents, % 100
- CURE SCHEDULE:
o 4 hours @ 65°C
o 24 hours @ 25°C
- CURED PROPERTIES:
o Glass transition temperature (Tg), °C 95
o Hardness, Shore D 90
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Color coded Epoxy, High Temperature Adhesive, Fast Cure, Two Part, Fiber Optic Connectors Repair & Assembly, F123, 5gm
- PRODUCT DESCRIPTION:
AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connectors. Although this unique three-step color-change formulation unmixed components are light yellow, it turns light green on mixing, and changes again to a deep reddish-amber after the REQUIRED 100°C HIGH TEMPERATURE CURE. It exhibits good wicking, and develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that includes most metals, ceramics, glass and many plastics.
AA-BOND F123 has good impact and thermal shock resistance, and yields excellent low stress, pot-and-polish connections which do not piston during cycle tests. It is also resistant to water and weathering, vapors and gases, most petroleum products, and an extended range of organic and inorganic environments. Shorter cures at higher temperatures e.g. 2 minutes at 120°C or 1 minute at 150°C are also possible. An additional post-cure of 30 minutes at 150°C is recommended when application temperatures higher than 150°C are anticipated.
- GENERAL PROPERTIES:
+Color: Clear, Light Yellow Unmixed
Clear, Reddish-Brown Cured
+ Components 2 component - requires mixing
+ Mix Ratio by weight 100:10 / Resin:Hardener
+ Benefits
Low viscosity, Thermal shock and impact resistant, Low stress connections, Color coded
- Cure Type: Room temperature or Heat Cure
- Operating Temperature: -60 to 175 °C
- Typical Applications:
Fiber optic assembly, multimode. single mode connectors, small potting, and sealing applications.
- UNCURED PROPERTIES:
Viscosity At 25 °C : 2100
Specific Gravity: 1.19
Pot Life: 2 hours
- CURE SCHEDULE:
24 hours At 25°C
5 minutes At 100°C
- CURED PROPERTIES:
Glass Transition (Tg), ultimate, °C: 120
Hardness, Shore D 85
Refractive Index 1.54
Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
CALL (888) 522-6742 for more informations.
Electronic Industries Epoxy Special Formulation Adhesive For PCB Components & Assembly, Aerospace, 2 Part, Thixotropic 2104, 5gm
- PRODUCT DESCRIPTION:
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties.
AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Milky translucent
Cure Type: Room temperature or Heat cure
Benefits:
* Great for Aerospace applications
* Great for reinforcing applications
* Bonds to many substrates
Mix Ratio by weight : 100:22 / Resin:Hardener
Substrates Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature: -40 to 125 °C
Typical Application(s):
PCB components, aerospace, anything where superior properties are required
- UNCURED PROPERTIES:
Solids Content: 100%
Specific Gravity, mixed: 1.19 g/cc
Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
MISC PROPERTIES:
Hardness, Shore D 88
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
High Temperature Epoxy Adhesive Glue, Fast Cure, Low Viscosity, 2 Part For LED Displays, Lenses, Fiber Optics Connectors, F131, 10gm
- PRODUCT DESCRIPTION:
AA-BOND F125 is an 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications.
AA-BOND F125 is clear, two part system is easily mixed and used at room temperature. Fiber optic connectors can be polished in as little as 15 to 20 minutes for piston free assurance. The high bond strength of AA-BOND F125 to glass, plastics, ceramics, metals and masonry allows it to be used in a wide array of applications including lens bonding, connector backfills, construction, component assembly and maintenance repair.
AA-BOND F125 is low shrinkage epoxy, develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25°C is required for fully matured bonds.
NOTE: AA-BOND F125 develops a high exotherm. Use immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready before mixing.
- GENERAL PROPERTIES:
• Components: 2 component - requires mixing
• Mix Ratio by weight: 100:95 / Resin:Hardener
• Benefits:
o Low viscosity
o Fast Cure
o Low shrinkage
• Cure Type: Room temperature or Heat cure
• Operating Temperature : -60 to 100 °C
• Typical Applications: Fiber optic assembly, multimode and single mode connectors, small potting and sealing applications
- UNCURED PROPERTIES:
• Viscosity @ 25 °C:
o Resin: 9000cP
o Hardener: 14000cP
• Specific Gravity : 1.19
• Pot Life: 5 minutes
- CURE SCHEDULE:
• 24 hours @ 25°C
• 1 hour @ 60°C
- CURED PROPERTIES:
• Glass Transition (Tg), ultimate, °C: 40
• Hardness, Shore D: 75
• Tensile Shear, alum to alum, psi: 2800
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Perfect Bond, Air Dry, Cold Solder, Nickel Epoxy, Electrically Conductive Adhesive, For RMI, EFI, Circuitry, Printed Circuit Board & Electronics Repai
- PRODUCT DESCRIPTION:
AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 3.8x10-2 ohm-cm.
AA-DUCT 903 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
AA-DUCT 903 has been used extensively in such diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
- GENERAL PROPERTIES:
Appearance : Grey
Cure Type: Heat cure or Room temperature
Benefits:
+ High strength
+ Perfect bond
+ Cold solder for high-sensitive components
Mix Ratio by weight 100:5 / Resin:Hardener
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Typical Applications Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
- UNCURED PROPERTIES:
Viscosity @ 25 °C cps Paste
Specific Gravity, mixed 2.79
Reactive solids contents, % 100
Pot Life 1 Hour
Shelf Life 1 Year
- CURED PROPERTIES:
Hardness, Shore D 85
Shrinkage linear in/in 0.003
Tensile Strength, psi 9500
Volume Resistivity ohm. cm < 0.038
Thermal Expansion Coefficient, (cm / cm / °C • 10-5) 1.46
Compressive Strength, psi 14,000
- CURE SCHEDULE:
15 minutes @ 100°C
45 minutes @ 50°C
24 hours Room temperature
THERMAL CONDUCTIVITY:
Thermal Conductivity, btu/hr/ft2/°F/in 100
Thermal Expansion Coefficient, (cm / cm / °C • 10-5) 1.5
Heat Distortions, °C 95
Operating Temperature Range, °C -50 to +170
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 for more information.
Perfect Bond, Air Dry, Cold Solder, Nickel Epoxy, Electrically Conductive Adhesive, For RMI, EFI, Circuitry, Printed Circuit Board & Electronics Repair, AA-DUCT 903, 5gm kit
$ 15.99 $ 16.15
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Effective Thermal Coupler Grease, Thermally Conductive, For Cooling, thermal management, Telecommunications, Hardware AA-GREASE 04, 500gm Jar
- PRODUCT DESCRIPTION: AA-GREASE 04 is an opaque white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. AA-GREASE 04 is silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation. AA-GREASE 04 thermal compound resists changes in consistency temperatures up to 180°C; function as heat transfer media, durable dielectric insulation, barrier against environmental contaminants and as a stress-relieving shock and vibration absorber over a wide temperature and humidity range. AA-GREASE 04 thermal paste is resistant to ozone and ultraviolet degradation and has good chemical and solvent stability, good interference between the heat producing device and the heat transfer media, and low surface tension that enables them to wet most surfaces. AA-GREASE 04 will not harden, dry, or melt after 1200 hours @ 205°C. - ELECTRICAL PROPERTIES: Dielectric Strength, volts/mil (ASTM D 150): 390 Dielectric Constant @ 100Hz (ASTM D150): 4.40 Dissipation Factor @ 100Hz (ASTM D150): 0.0021 Volume Resistivity, ohm-cm (ASTM D257): 2.9 x1014 - THERMAL PROPERTIES: Thermal Conductivity W/m-K 0.88 Operating Temperature Range, °C -60 to 205 Thermal Resistance °C-In2 /W 0.05 - LIMITATIONS: AA-GREASE 04 is neither tested nor represented as suitable for medical or pharmaceutical use. - CLEAN UP & DISPOSAL: AA-GREASE 04 can be removed by using solvents such as mineral spirit, heptane, or isopropyl alcohol. Dispose of in accordance with local, state and federal regulations for hazardous waste. - TYPICAL PROPERTIES AND CHEMICAL CHARACTERISTICS: Color: White Base Fluid: Dimethyl Polysiloxane Filler: Zinc oxide Specific Gravity, 25°C, gm/cc: 2.45 Viscosity: Paste Press Flow @ 42.5 PSI, 25°C sec: 13 Penetration (Worked), mm: 2851/10 Evaporation 24 hrs @25°C, %: 0.0 Evaporation @ 200°C 24H by weight, %: 0.5 Bleed 24 Hours, %: 0.6 - STORAGE HANDLING & SHELF LIFE: AA-GREASE 04 has a shelf life of 5 years at room temperature (76°F) in an unopened container, settlings may occur during long term storage, it is recommended to re-mix the filler by hand or mechanical mixing. Keep container tightly closed store in cool area away from ignition sources and oxidizers, no special precautions need to be taken if product is handled according to directions. Shelf AA-GREASE 04 is neither tested nor represented as suitable for medical or pharmaceutical use. - POTENTIAL USES: • Effective thermal coupler for any heat sink device, CPU to heat sink. • Automotive temperature-sensing devices. • Temperature sensors. • Applied to the base and mounting studs of transistor, diodes and silicone controlled rectifiers. • Power transistors. • Diodes, semiconductors. • Thermal Joints. • For any device where efficient cooling is required. • Potting. • TEC Modules. • Hardware. • Telecom
FDA Epoxy, 2 Part, Medium Viscosity, Good Resistance, Low Permeability, Class VI Approved Adhesive for Food Preparation, Processing & Packaging, FDA16
- PRODUCT DESCRIPTION:
AA-BOND FDA16 is a medium viscosity epoxy resin system specifically developed for medical device applications.
AA-BOND FDA16 has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.
- PRODUCT PROPERTIES:
• Appearance: Amber
• Mix Ratio, by weight: 100:33 / Resin:Hardener
• Benefits:
o Medium viscosity
o low permeability
o good resistance
o class VI approved
• Cure Type Heat cure or Room temperature
• Typical Applications Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
- UNCURED PROPERTIES:
• Viscosity @ 25 °C, cps 4,700 @ temperature 77°F, 25°C
• Specific Gravity, cured 0.900 g/cc
• Pot Life 25 min
• Solids Content 100%
• Volatile Organic Compounds (VOC) Content 0.15 g/l
• Water Absorption , after 24 HR saturation, % 0.30
- MECHANICAL PROPERTIES:
Lap Shear Strength alum to alum:
o 2,100 24 HR @ 25°C
o 3300 4 HR @ 65°C
Hardness, Shore D 86 (4 hrs @ 65°C, 75 24 hrs @ 25°C)
- CURED SCHEDULE:
1 – 4 hours @ 65°C
72 hours @ 25°C
- ELECTRICAL PROPERTIES:
Volume Resistivity 1.20e+14 ohm-cm
- THERMAL PROPERTIES:
CTE, linear: 29.4 µin/in-°F @ temperature 68.0 °F
Glass Transition Temp, Tg: 97.0 °C, 207 °F
Operating Temperature : -70 to 145 °C
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Steel Grey Epoxy For Tool & Dies Patching, Automotive, Industrial Maintenance, Casting, Modern Industrial, Bonding Applications Plumbing Molds Jigs Re
- PRODUCT DESCRIPTION:
AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required.
AA-BOND 2123 is easy-to-use adhesive system contains no solvents and cures fairly rapidly at room temperature to a hard, low shrinkage solid, which bonds readily to steel, aluminum, and other metals, wood, concrete, glass, ceramics and many plastics.
AA-BOND 2123 is tough and durable, resistant to water, mild acids and alkalis, salts and salt solutions, lubricating oils, petroleum solvents, gasoline, jet fuels, alcohol and many other organic and inorganic materials, While it may be attracted to a magnet, it is essentially an electrical insulator which can be readily drilled, cut, sawed and machined with regular metal working tools Typical repair applications: jigs, molds, dies, fixtures, plumbing, automotive, castings, aircraft, ships, marine, salvage.
- GENERAL PROPERTIES
• Appearance Steel grey
• Cure Type Room temperature or Heat Cure
• Benefits:
o Casting
o Jigs
o Molds
o Forming dies
o Plumbing Repairs
o Tool and dies patching
o Automotive repairs
o Industrial maintenance
• Mix Ratio by weight 100:10 / Resin:Hardener
• Substrates Most metals, ceramic, glass and plastics
• Operating Temperature -60 to 135 ªC
• Typical Applications:
Modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required.
- UNCURED PROPERTIES:
• Viscosity @ 25 °C, cps 3,200
• Thixotropic Index 1.0
• Specific Gravity, mixed 2.34
• Reactive solids contents, % 100
• Pot Life 30 minutes
- CURE SCHEDULE:
• 4 hours @ 65°C
• 24 hours @ 25°C
For masses over 25gm, allow material to gel for 4 hours @ 25°C follow by 100°C for 5 hours.
- CURED PROPERTIES:
• Hardness, Shore D 88
• Machinability Good
• Magnetic Yes
• GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more informations.
Electrical Insulator Epoxy For Bonding, Laminating, Equipment, Hearing Aids, Dental Products, Biomedical Instruments Device FDA22, 100 gm Pouch
- PRODUCT DESCRIPTION:
AA-BOND FDA22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300.
AA-BOND FDA22 is two-parts tan adhesive is easily mixed, used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
AA-BOND FDA22 is an effective electrical insulator, and it provides low permeability to gases and vapors, and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and inorganic compounds
- PRODUCT PROPERTIES:
Appearance: Light Tan
Cure Type: Heat cure or Room temperature
Benefits:
• High viscosity
• Easily mixed
• Electrical insulator
• Low permeability
• Good resistance
Mix Ratio by weight: 100:40 / Resin:Hardener
Substrates: Most metals, ceramic, glass and plastics
Operating Temperatures: -70 to 145 °C
- Typical Applications:
Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
- UNCURED PROPERTIES:
Viscosity @ 25 °C, cps: 27,000
Thixotropic Index: 1.2
Specific Gravity, mixed: 1.44
- CURED PROPERTIES:
Hardness, Shore D: 78
CTE, Linear: 26.1 µin/in-°F
Dielectric strength kv/in: 420
Volume Resistivity ohm-cm: 1.50e+14
Elongation at Yield: 5.0 %
Adhesive Bond Strength : 2100 psi Lap shear, alum to alum
- ELECTRICAL PROPERTIES:
Volume Resistivity: 1.50e+14 ohm-cm
Dielectric Constant: 3.5 @ frequency 1000 Hz
Dielectric Strength: 420 kV/in
Dissipation Factor: 0.020 @ frequency 1000 Hz
- CURE SCHEDULE:
1-4 Hours @ 65°C
24 to 36 Hours @ 25°C
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
High Impact Strength Epoxy For Electronic Industries, PCB, Aerospace, Staking Components, Bonding, Laminating, Repair, 2 Part, 2110, 100gm
- PRODUCT DESCRIPTION:
AA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, non-sag, non-drip and improved impact strength properties are required.
AA-BOND 2110 is easy-to-use two parts adhesive system contains no volatile solvents, readily cures at room temperature, and bonds to most materials including glass and glass fabrics, ceramics, wood, leather, most metals, and many plastics.
AA-BOND 2110 is strong, tough, resilient, has superior mechanical impact and thermal shock resistance characteristics, and is also highly resistant to weather, water, gases and vapors, most petroleum products and fuels, salts, mild acids and alkalis, and many other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Hazy off white
Cure Type: Room temperature or Heat cure
Benefits:
• High Impact strength
• Good wetting
• Long pot life
Mix Ratio by weight: 100:30 / Resin:Hardener
Substrates:
Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature: -70 to 100 °C
Typical Applications:
PCB components, aerospace, anything where superior properties are required
- UNCURED PROPERTIES
Specific Gravity, mixed: 1.25 g/cc
Viscosity @25 °C, cps: 65000
Pot Life: 1 hour
- CURE SCHEDULE:
10 hours @ 65°C
24 hours @ 25°C
- MISC PROPERTIES:
Volume Resistivity: 9.30e+8 ohm-cm
Dielectric Constant: 4.7
Dielectric Strength: 430 kV/in
CTE, linear: 30.5 µin/in-°F @ RT
Hardness, Shore D: 80
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
Electronic Industries Epoxy Special Formulation Adhesive For PCB Components & Assembly, Aerospace, 2 Part, Thixotropic 2104, 100gm
- PRODUCT DESCRIPTION:
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties.
AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
Appearance: Milky translucent
Cure Type: Room temperature or Heat cure
Benefits:
* Great for Aerospace applications
* Great for reinforcing applications
* Bonds to many substrates
Mix Ratio by weight : 100:22 / Resin:Hardener
Substrates Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature: -40 to 125 °C
Typical Application(s):
PCB components, aerospace, anything where superior properties are required
- UNCURED PROPERTIES:
Solids Content: 100%
Specific Gravity, mixed: 1.19 g/cc
Pot Life: 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
MISC PROPERTIES:
Hardness, Shore D 88
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
AVAILABILITY:
This epoxy can be supplied in various different packages
CALL (888) 522-6742 for more information.
FDA Epoxy Adhesive, Medical Grade Medium Viscosity, AA-BOND FDA26, 100gm
- PRODUCT DESCRIPTION: AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food preparation, processing and packaging equipment and devices. - PRODUCT PROPERTIES: Appearance: Grey Cure Type: Heat cure or Room temperature Benefits: * Excellent durability * High shear and peel strength * Heat and impact resistant * Handy duo-pack cartridges for easy mixing Mix Ratio by weight: 100:14 / Resin: Hardener Substrates: Most metals, ceramic, glass and plastics Operating Temperatures: -60 to 135 °C - UNCURED PROPERTIES: Viscosity @ 25 °C, cps: 17, 500 ±1000 @ temperature 77 °F, 25 °C Specific Gravity, mixed: 2.36 Reactive solids contents, %: 100 Pot Life: 50 minutes - CURE SCHEDULE: 1-4 Hours: @ 65°C 24 Hours: @ 25°C - CURED PROPERTIES: * Adhesive Bond Strength, psi: o 2120 ( 1 hr @ 65°C) o 2190 (24 hrs @ 25°C) * Hardness, Shore D 86 (24 HR @ 25°C) * 90 (1 hr @ 65°C) - THERMAL PROPERTIES: Glass transition temperature (Tg) 113°C, 235 °F - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 For More Informations.
High Impact Epoxy, Two Part Adhesive, Medium Viscosity, AA-BOND 2135 , 100gm kit
This is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact strength properties are required. This superior, two-part adhesive is easily mixed and handled at room temperature, and develops strong, tough, high performance bonds to metals, ceramics, wood, concrete, phenolics, polyesters, epoxies, many urethanes and other plastics, and to many other materials. Fully cured this product is a tough, durable, electrically insulating adhesive with excellent mechanical, impact and shock resistance properties. In addition, it provides good resistance to gases, vapors, weather, water, petroleum solvents, anti-icing fluids, salt solutions, many mild acids and alkalis, and many other organic materials. Easy mix pre-measured pouch. Simple mix and use without any mess.
Excellent Flow & Structural Bonding Epoxy Adhesive, No Sag for Vertical Applications & Overhead Surfaces, FS291, 100gm
• PRODUCT DESCRIPTION:
AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics.
• GENERAL PROPERTIES:
Cure Type: Heat cure or Room temperature
Benefits:
o Excellent flow
o Excellent wetting characteristics
o Works on a wide variety of substrates
Mix Ratio by weight: 100:81 / Resin:Hardener
Substrates:
o Glass
o most metals
o variety of plastics
Typical Applications:
o Structural bonding
o Overhead and vertical applications
Pot Life: 45 minutes
• CURE SCHEDULE:
o 1 hour at 65°C
o 24 hours at 25°C
• MISC PROPERTIES:
Volume Resistivity: 2.70e+13 ohm-cm
Hardness, Shore D: 78
Lap shear: 3300 psi (Alum to Alum)
• GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
• AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For More Informations.
Glass Epoxy Adhesive Laminating , Crystal Clear, Glass to Glass, Glass To Plastics, AA-BOND 2119, 100 gm
- PRODUCT DESCRIPTION:
AA-BOND 2119 is a crystal clear adhesive specifically designed for bonding glass to glass and glass to plastics. It also yields a high lap shear strength to metals and ceramics.
AA-BOND 2119 cures to a semi-rigid hardness making it ideal for bonding dissimilar substrates especially when thermal cycling is required.
AA-BOND 2119 is a two part adhesive also has a low exotherm and therefore can be used for small pottings and filling bond gaps up to 1/8 inch.
- GENERAL PROPERTIES:
• Appearance Clear
• Cure Type Room temperature or Heat Cure
• Benefits
o Crystal clear
o Specifically designed for glass
o High lap shear strength to metals and ceramics
• Refractive Index 1.53
• Substrates Glass, ceramics, plastics and metals
• Water Absorption 0.49%
• Typical Applications Glass to glass, dissimilar substrates
- UNCURED PROPERTIES:
• Viscosity @ 25 °C, cps 500
• Thixotropic Index 1.0
• Specific Gravity, mixed 1.07 g/cc
• Reactive solids contents, % 100
• Pot Life 2 hours
- CURE SCHEDULE:
• 60-120 minutes @ 65°C
• 24 hours @ 25°C
Note: For masses over 25gm, allow material to gel for 4 hours @ 25°C follow by 100°C for 5 hours.
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C 120
• Hardness, Shore D 75
• VOC Content 87.7 g/l
• GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Metal Repair Epoxy, Steel filled Adhesive, High Performance, AA-BOND FS313 , 100gm kit
PRODUCT DESCRIPTION:
This Product is steel epoxy, tooling resin features a highly filled, low viscosity composition for low shrinkage,can be easily drilled, tapped, polished, milled, sawed, or turned on a lathe, with conventional metal-working tools. This unique resin system is recommended for the fabrication of metal and vacuum form molds, hammer forms, drop hammer dies, foundry patterns, master molds, core filling, draw and stretch dies, lay-up molds, etc. Easy mix pre-measured pouch. Simple mix and use without any mess.
Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 100gm
- PRODUCT DESCRIPTION:
AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.
AA-BOND FDA2T is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, lubricants and fuels, to mild acids and alkalis, and many other organic and inorganic compounds.
- PRODUCT PROPERTIES:
Appearance: Amber
Cure Type: Heat cure or Room Temperature
Benefits:
Medium viscosity
Electrically Insulating
Low permeability to gases and vapors
Low temperature cure
Mix Ratio by weight: 100:93 / Resin: Hardener
Typical Applications: Medical, Food preparation processing and packaging
- UNCURED PROPERTIES:
Viscosity @ 25 °C, cps: 25000 ±1000
Specific Gravity, mixed: 1.119
Pot Life: 3 hours
- CURE SCHEDULE:
1 to 4 Hours @ 65°C
24 Hours @ 25°C
- THERMAL PROPERTIES:
CTE, linear: 29.4 µin/in-°F @ temperature 68 °F
Glass Transition Temp, Tg: 70.0 °C, 158 °F
Operating Temperature :-70 to 145 °C
- CURED PROPERTIES:
Coefficient of Thermal Expansion, cm/cm/ºC: 5.30×10-05
Hardness, Shore D: 79
Elongation at Yield: 9.0 %
Adhesive Bond Strength :1800 psi
- ELECTRICAL PROPERTIES:
Volume Resistivity: 1.20e+14 ohm-cm
Dielectric Constant: 3.4 @ frequency 1000 Hz
Dielectric Strength: 420 kV/in
Dissipation Factor: 0.020
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
Call (888) 522-6742 For any Question.
Good Electrical Insulation Epoxy For PCB Staking Electronics Aerospace Industrial Bonding Laminating Repair Applications 2112, 100gm
- PRODUCT DESCRIPTION:
AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.
AA-BOND 2112 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.
AA-BOND 2112 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.
- GENERAL PROPERTIES:
• Appearance: Milky translucent
• Cure Type: Room temperature or Heat Cure
• Benefits:
o Tough enamel like cure
o Bonds variety of substrates
o Good electrical insulation
o Weather resistant
Mix Ratio by weight: 100:22 / Resin:Hardener
Substrates:
Metals, glass, ceramics, wood and many plastics
Operating Temperature : -60 to 125 °C
Typical Applications:
Printed circuit board repair, staking components, bonding, laminating and repair applications.
- UNCURED PROPERTIES:
Viscosity @ 25 °C, mPa·s (cP) 60000 cPs
Thixotropic Index 6.5
Specific Gravity, mixed 1.2
Reactive solids contents, % 100
Pot Life 30 minutes
- CURE SCHEDULE:
4 hours @ 65°C
24 hours @ 25°C
- MISC PROPERTIES:
• Volume Resistivity 6.00e+13 ohm-cm
• Dielectric Constant 4.6
• Dielectric Strength 16.1 kV/in
• CTE, linear: 55.0 µm/m-°C@ Temperature 20.0 °C
• Glass Transition Temp, Tg 93 °C
• Hardness, Shore D 90
• Lap shear 1900 psi (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.
CALL (888) 522-6742 for more information.
