Buy Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm in United States - Cartnear.com

Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm

CTNR1482583 CTNR1482583

Atom Adhesives

Atom Adhesives
2025-11-05 USD 13.53

$ 13.53 $ 13.95

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Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm
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Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm
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Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm
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Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm
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Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm
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Food & Drug Administration Medical Grade Epoxy, Electrically Insulating, Food Preparation Processing & Packaging Adhesive FDA2T, 5gm
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Brand Atom Adhesives
Model AA-BOND FDA2T-5
Type Adhesives
Color/Finish Amber
Application Medical, Food preparation processing and packaging
Features Medium viscosity, electrically Insulating, low permeability to gases and vapors, low temperature cure
- PRODUCT DESCRIPTION: AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval. AA-BOND FDA2T is an effective electrical insulator, and it provides low permeability to gases and vapors and good resistance to water, weather, lubricants and fuels, to mild acids and alkalis, and many other organic and inorganic compounds. - PRODUCT PROPERTIES: Appearance: Amber Cure Type: Heat cure or Room Temperature Benefits: Medium viscosity Electrically Insulating Low permeability to gases and vapors Low temperature cure Mix Ratio by weight: 100:93 / Resin: Hardener Typical Applications: Medical, Food preparation processing and packaging - UNCURED PROPERTIES: Viscosity @ 25 °C, cps: 25000 ±1000 Specific Gravity, mixed: 1.119 Pot Life: 3 hours - CURE SCHEDULE: 1 to 4 Hours @ 65°C 24 Hours @ 25°C - THERMAL PROPERTIES: CTE, linear: 29.4 µin/in-°F @ temperature 68 °F Glass Transition Temp, Tg: 70.0 °C, 158 °F Operating Temperature :-70 to 145 °C - CURED PROPERTIES: Coefficient of Thermal Expansion, cm/cm/ºC: 5.30×10-05 Hardness, Shore D: 79 Elongation at Yield: 9.0 % Adhesive Bond Strength :1800 psi - ELECTRICAL PROPERTIES: Volume Resistivity: 1.20e+14 ohm-cm Dielectric Constant: 3.4 @ frequency 1000 Hz Dielectric Strength: 420 kV/in Dissipation Factor: 0.020 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 For More Informations.

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