Gold Epoxy, 2 Part, Electrically & Thermally Conductive For Hybrid Circuits Joining Die & SMD, Au Thick Film Conductor Traces & Contact Pads, G298, 5gm

PRODUCT DESCRIPTION: AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. GENERAL PROPERTIES: Components: A & B Appearance: Brown Cure Type: Room temperature or Heat cure Benefits: + Gold filled epoxy allows for anti-oxidation of Contacts and terminals in high reliability devices. + It can be used in medical circuits using traditional hybrid packaging technologies. + High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes. + Mix Ratio by weight: 100:13.5 / Resin:Hardener + Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics + Operating Temperature: Continuous: - 55°C to 275°C + Intermittent: - 55°C to 375°C + Typical Applications: Adhesive for joining die and SMDs onto the hybrid circuits + Repairing defective Au thick-film conductor traces and contact pads + Resisting oxidation and electro-migration in high-reliability micro-electronics + Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C UNCURED PROPERTIES: Viscosity @ 25 °C, mPa·s (cP): Paste Pot Life: 30 mins Shelf Life: 1 Year CURE SCHEDULE: 15 minutes: @ 120°C 90 minutes: @ 80°C 10 hours: @ 50°C 24 hours: @ 25°C MISC PROPERTIES: Volume Resistivity: @ 23°C: = 0.0009 Ohm-cm Glass Transition Temp, Tg: = 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 0—200°C @ 20°C/Min) Die Shear Strength: @ 23°C: = 5 Kg / 1,700 psi GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 for more information.