Electronic Industries Epoxy, Special Formulation Adhesive For PCB Components & Assembly, Aerospace, 2 Part, Thixotropic 2104, 2.5gm

- PRODUCT DESCRIPTION: AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds. - GENERAL PROPERTIES: Appearance: Milky translucent Cure Type: Room temperature or Heat cure Benefits: * Great for Aerospace applications * Great for reinforcing applications * Bonds to many substrates Mix Ratio by weight : 100:22 / Resin:Hardener Substrates Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics Operating Temperature: -40 to 125 °C Typical Application(s): PCB components, aerospace, anything where superior properties are required - UNCURED PROPERTIES: Solids Content: 100% Specific Gravity, mixed: 1.19 g/cc Pot Life: 30 minutes - CURE SCHEDULE: 4 hours @ 65°C 24 hours @ 25°C MISC PROPERTIES: Hardness, Shore D 88 GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more information.