Brand |
Atom Adhesives |
Model |
AA-BOND 2156-100 |
Type |
Adhesives |
Color/Finish |
Tan |
Application |
Fiber optic bundles, potting glass fibers and fiber optic connectors. |
Features |
Fast cure, strong, durable, high- impact bonds at room temperature that improves heat |
- PRODUCT DESCRIPTION:
AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
- GENERAL PROPERTIES:
• Appearance: Tan
• Cure Type: Room temperature or Heat cure
• Benefits:
o Fast cure
o Strong
o Durable
o High- impact bonds at room temperature that improves heat
• Mix Ratio by weight 100:23 / Resin:Hardener
• Operating Temperature -70 to 100 °C
• Typical Applications Fiber optic bundles, potting glass fibers and fiber optic connectors
- UNCURED PROPERTIES:
• Viscosity @ 25 °C 12,000 ±1000 (After Mixing)
• Specific Gravity, mixed 2.26
• Reactive solids contents, % 100
• Pot Life 5 minutes
- CURE SCHEDULE:
• 1 hour @ 25°C
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C: 33
• Hardness, Shore D: 79
• Lap shear strength, psi: 3400 (Alum to Alum)
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.