Thermally Conductive Epoxy Adhesive, Electrically Insulating Bond, Fiber Optic Bundles, Potting Glass, Fibers & Fiber Optic Connectors 2 Part 2156, 10gm kit

- PRODUCT DESCRIPTION: AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application. - GENERAL PROPERTIES: • Appearance: Tan • Cure Type: Room temperature or Heat cure • Benefits: o Fast cure o Strong o Durable o High- impact bonds at room temperature that improves heat • Mix Ratio by weight 100:23 / Resin:Hardener • Operating Temperature -70 to 100 °C • Typical Applications Fiber optic bundles, potting glass fibers and fiber optic connectors - UNCURED PROPERTIES: • Viscosity @ 25 °C 12,000 ±1000 (After Mixing) • Specific Gravity, mixed 2.26 • Reactive solids contents, % 100 • Pot Life 5 minutes - CURE SCHEDULE: • 1 hour @ 25°C - CURED PROPERTIES: • Glass transition temperature (Tg), °C: 33 • Hardness, Shore D: 79 • Lap shear strength, psi: 3400 (Alum to Alum) - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more informations.