Excellent Flow & Structural Bonding Epoxy Adhesive, No Sag for Vertical Applications & Overhead Surfaces, FS291 5gm

• PRODUCT DESCRIPTION: AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics. • GENERAL PROPERTIES: Cure Type: Heat cure or Room temperature Benefits: o Excellent flow o Excellent wetting characteristics o Works on a wide variety of substrates Mix Ratio by weight: 100:81 / Resin:Hardener Substrates: o Glass o most metals o variety of plastics Typical Applications: o Structural bonding o Overhead and vertical applications Pot Life: 45 minutes • CURE SCHEDULE: o 1 hour at 65°C o 24 hours at 25°C • MISC PROPERTIES: Volume Resistivity: 2.70e+13 ohm-cm Hardness, Shore D: 78 Lap shear: 3300 psi (Alum to Alum) • GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). • AVAILABILITY: This epoxy can be supplied in various different packages Call (888) 522-6742 For More Informations.