Buy Good Electrical Insulation Epoxy For PCB Staking Electronics Aerospace Industrial Bonding Laminating Repair Applications 2112, 5gm in United States - Cartnear.com

Good Electrical Insulation Epoxy For PCB Staking Electronics Aerospace Industrial Bonding Laminating Repair Applications 2112, 5gm

CTNR1102012 CTNR1102012

Atom Adhesives

Atom Adhesives
2025-11-24 USD 13.53

$ 13.53 $ 13.95

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Good Electrical Insulation Epoxy For PCB Staking Electronics Aerospace Industrial Bonding Laminating Repair Applications 2112, 5gm
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Good Electrical Insulation Epoxy For PCB Staking Electronics Aerospace Industrial Bonding Laminating Repair Applications 2112, 5gm
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Brand Atom Adhesives
Model AA-BOND 2112-5
Type Adhesives
Color/Finish Milky Translucent
Application Printed circuit board repair, staking components, bonding, laminating and repair applications.
Features Tough enamel like cure, Bonds variety of substrates, Good electrical insulation, Weather resistant
- PRODUCT DESCRIPTION: AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. AA-BOND 2112 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. AA-BOND 2112 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds. - GENERAL PROPERTIES: • Appearance: Milky translucent • Cure Type: Room temperature or Heat Cure • Benefits: o Tough enamel like cure o Bonds variety of substrates o Good electrical insulation o Weather resistant Mix Ratio by weight: 100:22 / Resin:Hardener Substrates: Metals, glass, ceramics, wood and many plastics Operating Temperature : -60 to 125 °C Typical Applications: Printed circuit board repair, staking components, bonding, laminating and repair applications. - UNCURED PROPERTIES: Viscosity @ 25 °C, mPa·s (cP): 60000 cPs Thixotropic Index: 6.5 Specific Gravity, mixed: 1.2 Reactive solids contents, %: 100 Pot Life: 30 minutes - CURE SCHEDULE: 4 hours @ 65°C 24 hours @ 25°C - MISC PROPERTIES: • Volume Resistivity 6.00e+13 ohm-cm • Dielectric Constant 4.6 • Dielectric Strength 16.1 kV/in • CTE, linear: 55.0 µm/m-°C @ Temperature 20.0 °C • Glass Transition Temp, Tg: 93 °C • Hardness, Shore D: 90 • Lap shear : 1900 psi (Alum to Alum) - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more information.

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