Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA’s Outgassing For EMI RFI Shielding, Circuit Boards & Electronic Component N02, 250gm

- PRODUCT DESCRIPTION: AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly. AA-DUCT N02 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list. AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C. AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing. - PRODUCT DESCRIPTION: Base: Epoxy Appearance :Grey Cure Type: Heat cure or Room temperature Mix Ratio by weight : 100:6 / Resin:Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: -60 to 110 °C Viscosity @ 25 °C cps Soft: Paste Shelf Life: 6 months - CURED PROPERTIES: Hardness, Shore D: 88 Volume Resistivity ohm-cm: 3.8 x 10-2 - CURE SCHEDULE: 2 Hours @ 125 °C 1 hour @ 150°C 30 min @ 175 °C - THERMAL CHARACTERISTICS: Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1 Operating Temp. Range, °C: -55 to +175 - NASA OUTGASSING RESULTS: TML (Total Mass Loss): % 0.25 CVCM (Collected Volatile Condensable Materials): % 0.00 WVR (Water Vapor Recovery): % 0.07 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. - PRODUCT DESCRIPTION: AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive. AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry. - GENERAL INFORMATION: Appearance: Silver Coated ceramic %Silver coated ceramic : 76 Cure Type: Heat cure Benefits: - High strength - Perfect bond - EMI & RFI shielding - Wave guides Substrates: Excellent choice for the Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Catalyst: Anhydride - CURED PROPERTIES: Sheet Resistivity: <0.1 O/sqcm Lap shear strength: 2000 Lb/in2 (1400 N/cm2) Bulk Resistivity: 3x10-5 O/cm Adhesion Tensile Strength: 1000 N/cm2 (1500 lb/in2) Thermal Conductivity: 0.04J/(cm.s. °C) [0.01cal/(cm.s. °C)] Specific heat: 0.30J/(g. °C) : [0.07 cal/g. °C] Coefficient of Thermal Expansion: 3x10-5 (m/m)/ °C Modulus of elasticity: 4x1010 Pa (6x105 lb/in2) Poisson’s Ratio: 0.35 - CURE SCHEDULE: 0.7 hours @ 200°C, 392°F 1.5 hours @ 180°C, 356°F 2.5 hours @ 160°C, 320°F - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safet