Buy Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA's Outgassing For EMI RFI Shielding, Circuit Boards & Electronic Component N02, 2.5gm in United States - Cartnear.com
Nickel Adhesive Electrically Conductive Epoxy, 1 Part, Heat Cure Only, Fast Cure, Ease In Handling, Passes NASA's Outgassing For EMI RFI Shielding, Circuit Boards & Electronic Component N02, 2.5gm
CTNR1070998 CTNR1070998Atom Adhesives
2025-11-21
/itm/nickel-adhesive-electrically-conductive-epoxy-1-part-heat-cure-only-fast-cure-ease-in-handling-passes-nasas-outgassing-for-emi-rfi-shielding-circuit-boards-electronic-component-n02-25gm-1070998
USD
18.49
$ 18.49 $ 18.68
Item Added to Cart
customer
*Product availability is subject to suppliers inventory
SHIPPING ALL OVER UNITED STATES
100% MONEY BACK GUARANTEE
EASY 30 DAYSRETURNS & REFUNDS
24/7 CUSTOMER SUPPORT
TRUSTED AND SAFE WEBSITE
100% SECURE CHECKOUT
| Brand | Atom Adhesives |
|---|---|
| Model | AA-DUCT N02-2.5 |
| Type | Adhesives |
| Color/Finish | Gray |
-
PRODUCT DESCRIPTION: AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly. AA-DUCT N02 passes NASA's outgassing testing (ASTM E-595) and is listed in NASA's Outgassing Data for Selecting Spacecraft Materials list. AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C. AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing.
- PRODUCT DESCRIPTION:
Base: Epoxy Appearance Grey Cure Type Heat cure or Room temperature Mix Ratio by weight 100:6 /
Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature -60 to 110 °C Viscosity @ 25 °C cps Soft Paste Shelf Life 6 months -
CURED PROPERTIES: Hardness, Shore D 88 Volume Resistivity ohm-cm 3.8 x 10-2 -
CURE SCHEDULE: 2 Hours @ 125 °C 1 hour @ 150°C 30 min @ 175 °C -
THERMAL CHARACTERISTICS: Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1 Operating Temp. Range, °C -55 to +175 -
NASA OUTGASSING RESULTS: TML (Total Mass Loss) % 0.25 CVCM (Collected Volatile Condensable Materials) % 0.00 WVR (Water Vapor Recovery) % 0.07 -
GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY: This epoxy can be supplied in various different packages.
PRODUCT DESCRIPTION: AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly. AA-DUCT N02 passes NASA's outgassing testing (ASTM E-595) and is listed in NASA's Outgassing Data for Selecting Spacecraft Materials list. AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C. AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing.
- PRODUCT DESCRIPTION:
Base: Epoxy Appearance Grey Cure Type Heat cure or Room temperature Mix Ratio by weight 100:6 /
Resin: Hardener Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature -60 to 110 °C Viscosity @ 25 °C cps Soft Paste Shelf Life 6 months -
CURED PROPERTIES: Hardness, Shore D 88 Volume Resistivity ohm-cm 3.8 x 10-2 -
CURE SCHEDULE: 2 Hours @ 125 °C 1 hour @ 150°C 30 min @ 175 °C -
THERMAL CHARACTERISTICS: Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1 Operating Temp. Range, °C -55 to +175 -
NASA OUTGASSING RESULTS: TML (Total Mass Loss) % 0.25 CVCM (Collected Volatile Condensable Materials) % 0.00 WVR (Water Vapor Recovery) % 0.07 -
GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY: This epoxy can be supplied in various different packages.
