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Buy One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit in United States - Cartnear.com

One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit

CTNR1262194 CTNR1262194

Atom Adhesives

Atom Adhesives
2025-12-22 USD 47.42

$ 47.42 $ 48.39 2% Off

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One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit
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One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit
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One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit
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One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit
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One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit
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One to One Mix Ratio Electrically Conductive Silver Epoxy For Cold Solder Circuitry, RMI, EFI, PCB, & Electronic Repair 907, 10 gm kit
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Brand Atom Adhesives
Model AA-DUCT 907-10
Type Adhesives
Color/Finish Silver
Application Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
Features High strength, Perfect bond, Cold solder for heat-sensitive components
+
PRODUCT DESCRIPTION: AA-DUCT 907 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm*cm. AA-DUCT 907 is also characterized by a wide operating temperature range from –50 to +170°C. AA-DUCT 907 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
+ PRODUCT PROPERTIES: -
Appearance: Silver -
Cure Type: Heat cure or Room temperature -
Benefits: * High strength * Perfect bond * Cold solder for heat-sensitive components - Mix Ratio by weight 100:100 /
Resin: Hardener -
Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
- Operating Temperature: –50 to +170°C -
Typical Applications: Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair +
UNCURED PROPERTIES: - Specific Gravity, mixed: 2.79 - Reactive solids contents, %: 100 -
Pot Life: 1Hour -
Shelf Life: 6 months -
Viscosity: Paste +
CURE SCHEDULE: 15 minutes @ 100°C 45 minutes @ 50°C 24 hours @ Room temperature +
CURED PROPERTIES: - Hardness, Shore
D: 85 -
Shrinkage linear in/in: 0.0003 - Lap shear strength, psi: 9400 - Volume Resistivity ohm.
cm: < 0.0001 - Thermal Expansion Coefficient, (cm / cm / °C * 10-5): 1.5 - Thermal Conductivity, btu / hr / ft2 / °F / in: 100 -
Tensile Strength,
psi: 9500 - Compressive
Strength,
psi: 14, 000 - Heat Distortion, °C: 95 -
Electrical Resistivity: < 1x10 -4 ohm*cm +
GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
+ AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more informations.

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