Brand |
Atom Adhesives |
Model |
AA-BOND 2153-250 |
Type |
Adhesives |
Color/Finish |
Dark Grey |
Application |
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. |
Features |
Strong, durable, high impact bonds at room temperature |
- PRODUCT DESCRIPTION:
AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards.
AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.
- GENERAL PROPERTIES:
• Appearance Dark grey
• Cure Type Room temperature or Heat Cure
• Benefits:
Strong Durable High impact bonds at room temperature
Mix Ratio by weight 100:7 Resin:Hardener
Operating Temperature -40 to 125 °C
• Typical Applications:
Staking transistors
Diodes
Resistors
Integrated circuits and other heat-sensitive components to printed circuit boards
- UNCURED PROPERTIES:
• Specific Gravity, mixed 2.44
• Reactive solids contents, % 100
• Pot Life 30 minutes
- CURE SCHEDULE:
• 1-3 hours at 65°C
• 24 hours at 25°C.
- CURED PROPERTIES:
• Glass transition temperature (Tg), °C 110
• Hardness, Shore D 88
• Dielectric strength, volts/mil 410
CALL (888) 522-6742 for more informations.