Brand |
Atom Adhesives |
Model |
AA-DUCT N02-500 |
Type |
Adhesives |
Color/Finish |
Gray |
- PRODUCT DESCRIPTION:
AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly.
AA-DUCT N02 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list.
AA-DUCT N02 offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175°C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325°C.
AA-DUCT N02 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing.
- PRODUCT DESCRIPTION:
Base: Epoxy
Appearance :Grey
Cure Type: Heat cure or Room temperature
Mix Ratio by weight : 100:6 / Resin:Hardener
Substrates Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature: -60 to 110 °C
Viscosity @ 25 °C cps Soft: Paste
Shelf Life: 6 months
- CURED PROPERTIES:
Hardness, Shore D: 88
Volume Resistivity ohm-cm: 3.8 x 10-2
- CURE SCHEDULE:
2 Hours @ 125 °C
1 hour @ 150°C
30 min @ 175 °C
- THERMAL CHARACTERISTICS:
Thermal Conductivity, Btu/hr/ft2/°F/in: 10.1
Operating Temp. Range, °C: -55 to +175
- NASA OUTGASSING RESULTS:
TML (Total Mass Loss): % 0.25
CVCM (Collected Volatile Condensable Materials): % 0.00
WVR (Water Vapor Recovery): % 0.07
- GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
- AVAILABILITY:
This epoxy can be supplied in various different packages.