Milky Epoxy Solvent Free Passes NASA, Weather Resistant Adhesive For Critical Electronics, Aerospace, Industrial Applications Non-Sag Adhesive 2116, 2.5gm

- PRODUCT DESCRIPTION: AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies. AA-BOND 2116 is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics. AA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis. - GENERAL PROPERTIES: • Appearance Milky translucent • Cure Type Room temperature or Heat Cure • Benefits: o Passes NASA's Outgassing/Low Outgassing o Solvent free o Weather resistant • Mix Ratio by weight: 100:22.5 / Resin:Hardener • Substrates: Ceramics, glass to glass, fabrics, metals, laminates and other composite materials • Operating Temperature: -60 to 130 °C - UNCURED PROPERTIES: • Specific Gravity : 1.25 • Reactive solids contents, %: 100 • Pot Life: 30 minutes - CURE SCHEDULE: 4 hours @ 65°C 24 hours @ 25°C - MISC PROPERTIES: Volume Resistivity: 6.00e+13 ohm-cm Dielectric Constant: 4.5 Dielectric Strength: 410 kV/mil Hardness, Shore D: 88 - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. CALL (888) 522-6742 for more information.