Gold Epoxy, 2 Part, Electrically & Thermally Conductive For Hybrid Circuits Joining Die & SMD, Au Thick Film Conductor Traces & Contact Pads, G298, 10gm

- PRODUCT DESCRIPTION: AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. - GENERAL PROPERTIES: Components: A & B Appearance: Brown Cure Type: Room temperature or Heat cure Benefits: + Gold filled epoxy allows for anti-oxidation of Contacts and terminals in high reliability devices. It can be used in medical circuits using traditional hybrid packaging technologies. High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes. Mix Ratio by weight: 100:13.5 / Resin:Hardener Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics Operating Temperature: Continuous: - 55°C to 275°C Intermittent: - 55°C to 375°C Typical Applications: Adhesive for joining die and SMDs onto the hybrid circuits Repairing defective Au thick-film conductor traces and contact pads Resisting oxidation and electro-migration in high-reliability micro-electronics Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C - UNCURED PROPERTIES: Viscosity @ 25 °C, mPa·s (cP) Paste Pot Life 30 mins Shelf Life 1 Year - CURE SCHEDULE: 15 minutes: @ 120°C 90 minutes: @ 80°C 10 hours: @ 50°C 24 hours: @ 25°C - MISC PROPERTIES: Volume Resistivity: @ 23°C: = 0.0009 Ohm-cm Glass Transition Temp, Tg: = 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 10—200°C @ 20°C/Min) Die Shear Strength: @ 23°C: = 5 Kg / 1,700 psi - GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). - AVAILABILITY: This epoxy can be supplied in various different packages. Call (888) 522-6742 for more information.